{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T07:13:05Z","timestamp":1730272385846,"version":"3.28.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2020,10,1]],"date-time":"2020-10-01T00:00:00Z","timestamp":1601510400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,10,1]],"date-time":"2020-10-01T00:00:00Z","timestamp":1601510400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,10]]},"DOI":"10.1109\/iscas45731.2020.9181075","type":"proceedings-article","created":{"date-parts":[[2020,9,29]],"date-time":"2020-09-29T13:22:27Z","timestamp":1601385747000},"page":"1-5","source":"Crossref","is-referenced-by-count":4,"title":["2V\/3 Bias Scheme with Enhanced Dynamic Read Performances for 3-D Cross Point PCM"],"prefix":"10.1109","author":[{"given":"Yu","family":"Lei","sequence":"first","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Chinese Academy of Sciences, Shanghai, China; Shanghai Nanotechnology Promotion Center, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Meng","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhitang","family":"Song","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Houpeng","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2019.8702296"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2280296"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2017.2729665"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2606438"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2816246"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2015.08.001"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2654270"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2581038"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5433945"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2814544"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614505"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614686"},{"key":"ref5","doi-asserted-by":"crossref","first-page":"40802-040802","DOI":"10.1116\/1.4889999","article-title":"Access devices for 3D crosspoint memory","volume":"32","author":"burr","year":"2014","journal-title":"J Vac Sci Technol B"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614580"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2871197"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8350906"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2899720"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2019.2910846"}],"event":{"name":"2020 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2020,10,12]]},"location":"Seville, Spain","end":{"date-parts":[[2020,10,14]]}},"container-title":["2020 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9179985\/9180369\/09181075.pdf?arnumber=9181075","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,15]],"date-time":"2024-01-15T21:00:16Z","timestamp":1705352416000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9181075\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,10]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/iscas45731.2020.9181075","relation":{},"subject":[],"published":{"date-parts":[[2020,10]]}}}