{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:02:13Z","timestamp":1781884933688,"version":"3.54.5"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,21]],"date-time":"2023-05-21T00:00:00Z","timestamp":1684627200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,21]],"date-time":"2023-05-21T00:00:00Z","timestamp":1684627200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5,21]]},"DOI":"10.1109\/iscas46773.2023.10181484","type":"proceedings-article","created":{"date-parts":[[2023,7,21]],"date-time":"2023-07-21T17:19:44Z","timestamp":1689959984000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["A 6.78MHz Dual-Output Wireless Transfer System With Adaptive Global Power Control for Efficiency Enhancement"],"prefix":"10.1109","author":[{"given":"Zhi","family":"Li","sequence":"first","affiliation":[{"name":"School of Microelectronics, Northwestern Polytechnical University,Xi'an,China,710129"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kai","family":"Cui","sequence":"additional","affiliation":[{"name":"School of Computer Science, Northwestern Polytechnical University,Xi'an,China,710129"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhitong","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Northwestern Polytechnical University,Xi'an,China,710129"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yulong","family":"Gui","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Northwestern Polytechnical University,Xi'an,China,710129"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Quan","family":"Sun","sequence":"additional","affiliation":[{"name":"Xi'an Aerosemi Technology,Xi'an,China,710077"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lei","family":"Dong","sequence":"additional","affiliation":[{"name":"Xi'an Aerosemi Technology,Xi'an,China,710077"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanzhao","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Northwestern Polytechnical University,Xi'an,China,710129"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7063010"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2387832"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2016.2601623"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2927270"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2657603"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8351692"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2780169"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2927270"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3071221"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3035429"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2657603"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS48785.2022.9937965"}],"event":{"name":"2023 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Monterey, CA, USA","start":{"date-parts":[[2023,5,21]]},"end":{"date-parts":[[2023,5,25]]}},"container-title":["2023 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10181241\/10181318\/10181484.pdf?arnumber=10181484","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,4,13]],"date-time":"2024-04-13T04:30:59Z","timestamp":1712982659000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10181484\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5,21]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/iscas46773.2023.10181484","relation":{},"subject":[],"published":{"date-parts":[[2023,5,21]]}}}