{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,26]],"date-time":"2025-11-26T16:42:05Z","timestamp":1764175325779,"version":"3.37.3"},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001501","name":"University Grants Commission","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001501","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,5,28]]},"DOI":"10.1109\/iscas48785.2022.9937255","type":"proceedings-article","created":{"date-parts":[[2022,11,11]],"date-time":"2022-11-11T20:38:08Z","timestamp":1668199088000},"page":"852-856","source":"Crossref","is-referenced-by-count":4,"title":["Power Efficient Echo-Cancellation Based Hybrid for Full-Duplex Chip-to-Chip Interconnects"],"prefix":"10.1109","author":[{"given":"Prema Kumar","family":"Govindaswamy","sequence":"first","affiliation":[{"name":"University of Hyderabad,Centre for Advanced Studies in Electronics Science and Technology,Hyderabad,India"}]},{"given":"Nijwm","family":"Wary","sequence":"additional","affiliation":[{"name":"School of Electrical Sciences, Indian Institute of Technology,Bhubaneswar,Odisha,India"}]},{"given":"Vijaya Sankara Rao","family":"Pasupureddi","sequence":"additional","affiliation":[{"name":"School of Electrical Sciences, Indian Institute of Technology,Bhubaneswar,Odisha,India"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2697410"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.2984567"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2001.912547"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.818569"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.891719"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3022046"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.835837"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2962359"},{"key":"ref1","first-page":"957965","article-title":"Current-mode full-duplex (CMFD) signaling for high-speed chip-to-chip interconnect","volume":"42","author":"rao","year":"2011","journal-title":"Microelectron J"}],"event":{"name":"2022 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2022,5,27]]},"location":"Austin, TX, USA","end":{"date-parts":[[2022,6,1]]}},"container-title":["2022 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9937201\/9937203\/09937255.pdf?arnumber=9937255","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,28]],"date-time":"2022-11-28T20:21:39Z","timestamp":1669666899000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9937255\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5,28]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/iscas48785.2022.9937255","relation":{},"subject":[],"published":{"date-parts":[[2022,5,28]]}}}