{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,23]],"date-time":"2025-08-23T05:25:19Z","timestamp":1755926719782,"version":"3.37.3"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100000038","name":"Natural Sciences and Engineering Research Council of Canada","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100000038","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020487","name":"Nature","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100020487","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100008582","name":"McGill University","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100008582","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,5,28]]},"DOI":"10.1109\/iscas48785.2022.9937455","type":"proceedings-article","created":{"date-parts":[[2022,11,11]],"date-time":"2022-11-11T20:38:08Z","timestamp":1668199088000},"page":"1605-1609","source":"Crossref","is-referenced-by-count":8,"title":["Power Delivery for Ultra-Large-Scale Applications on Si-IF"],"prefix":"10.1109","author":[{"given":"Yousef","family":"Safari","sequence":"first","affiliation":[{"name":"McGill University,The Heterogeneous Integration Knowledge (THInK) Team,Department of Electrical and Computer Engineering,Montreal,QC,Canada,H3A 0E9"}]},{"given":"Anja","family":"Kroon","sequence":"additional","affiliation":[{"name":"McGill University,The Heterogeneous Integration Knowledge (THInK) Team,Department of Electrical and Computer Engineering,Montreal,QC,Canada,H3A 0E9"}]},{"given":"Boris","family":"Vaisband","sequence":"additional","affiliation":[{"name":"McGill University,The Heterogeneous Integration Knowledge (THInK) Team,Department of Electrical and Computer Engineering,Montreal,QC,Canada,H3A 0E9"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2018.8357278"},{"journal-title":"Three-Dimensional Integrated Circuit Design","year":"2017","author":"pavlidis","key":"ref11"},{"journal-title":"Heterogeneous Integration on Silicon-Interconnect Fabric Using Fine-Pitch Interconnects (?10 ?m)","year":"2020","author":"jangam","key":"ref12"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3065690"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2018.112130359"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA52012.2021.00014"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2018.032271057"},{"year":"2019","key":"ref17","article-title":"Heterogeneous integration roadmap"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2017.246"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-29395-0"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3075219"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2019.2940427"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586194"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2019.00093"},{"journal-title":"Power Distribution within Silicon Interconnect Fabric","year":"2021","author":"vaisband","key":"ref8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401673"},{"year":"2021","key":"ref2","article-title":"Cerebras Systems"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2010.5536970"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2019.8757286"},{"journal-title":"Package characterization techniques and envaluation of a plastic package for mm-wave applications","year":"2006","author":"engl","key":"ref20"},{"volume":"11","journal-title":"LM5145 75-V Synchronous Buck DC\/DC Controller With Wide Duty Cycle Range","year":"2020","key":"ref22"},{"volume":"1","journal-title":"4 5-V to 60-V Input 5-A Step-Down DC\/DC Converter with Eco-Mode™","year":"2019","key":"ref21"},{"year":"2021","key":"ref23","article-title":"MATLAB\/Simulink"}],"event":{"name":"2022 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2022,5,27]]},"location":"Austin, TX, USA","end":{"date-parts":[[2022,6,1]]}},"container-title":["2022 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9937201\/9937203\/09937455.pdf?arnumber=9937455","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,28]],"date-time":"2022-11-28T20:20:35Z","timestamp":1669666835000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9937455\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5,28]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/iscas48785.2022.9937455","relation":{},"subject":[],"published":{"date-parts":[[2022,5,28]]}}}