{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T07:08:28Z","timestamp":1730272108535,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,5,28]]},"DOI":"10.1109\/iscas48785.2022.9937804","type":"proceedings-article","created":{"date-parts":[[2022,11,11]],"date-time":"2022-11-11T15:38:08Z","timestamp":1668181088000},"page":"2107-2111","source":"Crossref","is-referenced-by-count":0,"title":["High-Speed Hardware Architecture for Post-Quantum Diffie\u2013Hellman Key Exchange Based on Residue Number System"],"prefix":"10.1109","author":[{"given":"Rei","family":"Ueno","sequence":"first","affiliation":[{"name":"Tohoku University, Katahira 2&#x2013;1&#x2013;1,Sendai,Japan,980\u20138577"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naofumi","family":"Homma","sequence":"additional","affiliation":[{"name":"Tohoku University, Katahira 2&#x2013;1&#x2013;1,Sendai,Japan,980\u20138577"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"s2n an implementation of the TLS\/SSL protocols","year":"2020","key":"ref4"},{"journal-title":"Post-quantum cryptogprahy","year":"2020","key":"ref3"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s13389-018-0195-8"},{"key":"ref6","first-page":"4842","article-title":"SIKE&#x2019;ed up: Fast hardware architectures for supersingular isogeny key encapsulation","volume":"67","author":"koziel","year":"2020","journal-title":"IEEE Trans Circ Syst I"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.46586\/tches.v2020.i2.245-271"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2017.2771535"},{"key":"ref7","first-page":"238","article-title":"Isog&#x00E9;nies entre courbes elliptiques","volume":"273","author":"v\u00e9lu","year":"1971","journal-title":"Comptes Rendus Hebdomadaires des S&#x00E9;ances de l&#x2019;Acad&#x00E9;mie des Sciences"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-25405-5_2"},{"journal-title":"Sike&#x2014;supersingular isogeny key encapsulation","year":"2020","author":"jao","key":"ref9"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/SFCS.1994.365700"}],"event":{"name":"2022 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2022,5,27]]},"location":"Austin, TX, USA","end":{"date-parts":[[2022,6,1]]}},"container-title":["2022 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9937201\/9937203\/09937804.pdf?arnumber=9937804","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,28]],"date-time":"2022-11-28T15:21:44Z","timestamp":1669648904000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9937804\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5,28]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/iscas48785.2022.9937804","relation":{},"subject":[],"published":{"date-parts":[[2022,5,28]]}}}