{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,24]],"date-time":"2025-04-24T05:10:08Z","timestamp":1745471408170,"version":"3.37.3"},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,28]],"date-time":"2022-05-28T00:00:00Z","timestamp":1653696000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100007225","name":"Ministry of Science and Technology","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100007225","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,5,28]]},"DOI":"10.1109\/iscas48785.2022.9937980","type":"proceedings-article","created":{"date-parts":[[2022,11,11]],"date-time":"2022-11-11T20:38:08Z","timestamp":1668199088000},"page":"742-746","source":"Crossref","is-referenced-by-count":1,"title":["Design of a mmWave Digital Baseband Receiver Integrated with WOLA-CP-OFDM Technique"],"prefix":"10.1109","author":[{"given":"Kang-Lun","family":"Chiu","sequence":"first","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics Engineering,Hsinchu,Taiwan (R.O.C.),300093"}]},{"given":"Hsun-Wei","family":"Chan","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics Engineering,Hsinchu,Taiwan (R.O.C.),300093"}]},{"given":"Hsuan-Ping","family":"Chiu","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics Engineering,Hsinchu,Taiwan (R.O.C.),300093"}]},{"given":"Chun-Yi","family":"Liu","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics Engineering,Hsinchu,Taiwan (R.O.C.),300093"}]},{"given":"Chih-Wei","family":"Jen","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics Engineering,Hsinchu,Taiwan (R.O.C.),300093"}]},{"given":"Shyh-Jye","family":"Jou","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics Engineering,Hsinchu,Taiwan (R.O.C.),300093"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/SPAWC.2015.7227001"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSAC.2017.2687358"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/MSP.2011.940267"},{"key":"ref13","first-page":"72","article-title":"System-on-chip processor using different FPGA architectures in the VTR CAD flow","author":"nadal","year":"0","journal-title":"2014 25nd IEEE International Symposium on Rapid System Prototyping Conference Proceedings"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2015.2468926"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2014.2345566"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2015.2502546"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICCS.2016.7833626"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2017.2781122"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2615084"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2017.1601107"},{"key":"ref3","first-page":"1","article-title":"IEEE Standard for Information Technology–Telecommunications and Information Exchange between Systems Local and Metropolitan Area Networks–Specific Requirements Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications Amendment 2: Enhanced Throughput for Operation in License-exempt Bands above 45 GHz","year":"2021","journal-title":"IEEE Std 802 11ay-2021 (Amendment to IEEE Std 802 11-2020 as amendment by IEEE Std 802 11ax-2021)"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCW.2017.7962689"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/GLOCOMW.2016.7849087"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/GLOCOMW.2013.6824990"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IWCMC.2015.7289245"},{"key":"ref2","first-page":"1","article-title":"IEEE Standard for Information technology–Telecommunications and information exchange between systems–Local and metropolitan area networks–Specific requirements-Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications Amendment 3: Enhancements for Very High Throughput in the 60 GHz Band","year":"2012","journal-title":"IEEE Std 802 11ad-2012 (Amendment to IEEE Std 802 11-2012 as Amended by IEEE Std 802 11ae-2012 and IEEE Std 802 11aa-2012)"},{"key":"ref1","article-title":"E-Band and V-Band - Survey on status of worldwide regulation","author":"frecassetti","year":"2015","journal-title":"Tech Rep"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2837693"},{"journal-title":"Qualcomm Inc 3GPP TSG-RAN WG1 #84b Tech Rep R1-162199","article-title":"Waveform Candidates","year":"2016","key":"ref20"},{"key":"ref22","article-title":"Implementation of 60 GHz WLAN Channel Model","author":"maslennikov","year":"2010","journal-title":"Tech Rep doc IEEE 802 11-10\/0854r3"},{"journal-title":"PHYsical Layer for DYnamic Spectrum AccesS and Cognitive Radio (PHYDYAS)","article-title":"FBMC physical layer: a primer","year":"2010","key":"ref21"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2017.2748565"},{"key":"ref23","article-title":"60 GHz Impairments Modeling","author":"erceg","year":"2009","journal-title":"Tech Rep IEEE doc 802 11-09\/1213r1"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2955925"}],"event":{"name":"2022 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2022,5,27]]},"location":"Austin, TX, USA","end":{"date-parts":[[2022,6,1]]}},"container-title":["2022 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9937201\/9937203\/09937980.pdf?arnumber=9937980","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,11,28]],"date-time":"2022-11-28T20:20:18Z","timestamp":1669666818000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9937980\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5,28]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/iscas48785.2022.9937980","relation":{},"subject":[],"published":{"date-parts":[[2022,5,28]]}}}