{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T07:09:33Z","timestamp":1730272173610,"version":"3.28.0"},"reference-count":35,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,5,1]],"date-time":"2021-05-01T00:00:00Z","timestamp":1619827200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,5,1]],"date-time":"2021-05-01T00:00:00Z","timestamp":1619827200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,5,1]],"date-time":"2021-05-01T00:00:00Z","timestamp":1619827200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,5]]},"DOI":"10.1109\/iscas51556.2021.9401066","type":"proceedings-article","created":{"date-parts":[[2021,4,27]],"date-time":"2021-04-27T21:33:36Z","timestamp":1619559216000},"page":"1-5","source":"Crossref","is-referenced-by-count":5,"title":["Towards an LTCC SiP for Control System in Safety-Critical Applications"],"prefix":"10.1109","author":[{"given":"Gabriel","family":"Nobert","sequence":"first","affiliation":[]},{"given":"Abdul-Hafiz","family":"Alameh","sequence":"additional","affiliation":[]},{"given":"Nam","family":"Ly","sequence":"additional","affiliation":[]},{"given":"Nicolas G.","family":"Constantin","sequence":"additional","affiliation":[]},{"given":"Yves","family":"Blaquiere","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"DuPont 7740 - Silver Conductor [Datasheet]","year":"2013","key":"ref33"},{"journal-title":"Thick Film Materials - C8728 [Datasheet]","year":"0","key":"ref32"},{"journal-title":"Low Temperature Co-Fired Ceramic Systems - A6M-E High Frequency LTCC Tape System [Datasheet]","year":"2015","key":"ref31"},{"journal-title":"A6M-E LTCC Mixed Metal Conductor System [Datasheet]","year":"2018","key":"ref30"},{"journal-title":"Thick Film Materials - IP9217 [Datasheet]","year":"0","key":"ref35"},{"journal-title":"Low Temperature Co-fired Ceramic Systems - DL10-088 LTCC Dielectric Paste [Datasheet]","year":"0","key":"ref34"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.4218\/etrij.2018-0551"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/3DPEIM.2016.7570574"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"504","DOI":"10.1109\/TADVP.2006.879496","article-title":"Embedded power: a 3-D MCM integration technology for IPEM packaging application","volume":"29","author":"zhenxian","year":"2006","journal-title":"IEEE Transactions on Advanced Packaging"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IMaRC.2015.7411446"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/3DPEIM.2018.8525236"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7276-7_14"},{"key":"ref16","first-page":"2060","article-title":"Evaluation of LTCC capacitors and inductors in DC\/DC converters","author":"laili","year":"2010","journal-title":"2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/82.204124"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS49341.2020.9159781"},{"journal-title":"Curamik (R) Ceramic Substrates [Datasheet]","year":"0","key":"ref19"},{"journal-title":"Laminate & Prepreg Manufacturing","year":"0","key":"ref28"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2013.6690980"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.1996.545107"},{"year":"2019","key":"ref3","article-title":"Integrated Power Electronics"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA.2014.6964620"},{"journal-title":"Non-Conductive & Conductive Copper Paste for Via Filling of Copper Plating Via [Datasheet]","year":"0","key":"ref29"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EPECS.2018.8443356"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC48849.2020.9229859"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2018.00208"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICAEE.2014.6838536"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.4218\/etrij.17.0117.0113"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.23919\/EPE.2019.8915000"},{"journal-title":"High Density Interconnect (HDI) PCBs [Fabrication Specifications]","year":"0","key":"ref20"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2748799"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2018.8654283"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2167231"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/HFPSC.2005.1566349"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2015.7168846"},{"journal-title":"LTCC Multi-Layer Ceramic Circuits [Fabrication Process]","year":"0","key":"ref25"}],"event":{"name":"2021 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2021,5,22]]},"location":"Daegu, Korea","end":{"date-parts":[[2021,5,28]]}},"container-title":["2021 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9401028\/9401051\/09401066.pdf?arnumber=9401066","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T15:44:08Z","timestamp":1652197448000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9401066\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,5]]},"references-count":35,"URL":"https:\/\/doi.org\/10.1109\/iscas51556.2021.9401066","relation":{},"subject":[],"published":{"date-parts":[[2021,5]]}}}