{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,30]],"date-time":"2025-12-30T08:58:51Z","timestamp":1767085131760,"version":"3.41.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100020487","name":"Nature","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100020487","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,5,25]]},"DOI":"10.1109\/iscas56072.2025.11043354","type":"proceedings-article","created":{"date-parts":[[2025,6,27]],"date-time":"2025-06-27T17:42:19Z","timestamp":1751046139000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["TNURML: Triple-Node-Upset-Recovery Magnetic Latch Design with Non-Volatility for Aerospace Applications"],"prefix":"10.1109","author":[{"given":"Aibin","family":"Yan","sequence":"first","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhiyuan","family":"Pei","sequence":"additional","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xing","family":"Guo","sequence":"additional","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jie","family":"Song","sequence":"additional","affiliation":[{"name":"Anhui University,School of Computer Science and Technology,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cuiyun","family":"Jiang","sequence":"additional","affiliation":[{"name":"Hefei University of Technology,School of Mathematics,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huaguo","family":"Liang","sequence":"additional","affiliation":[{"name":"Hefei University of Technology,School of Microelectronics,Hefei,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"Kyushu Institute of Technology,Department of Computer Science and Networks,Fukuoka,Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Patrick","family":"Girard","sequence":"additional","affiliation":[{"name":"University of Montpellier \/ CNRS,LIRMM,Montpellier,France"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2024.3426271"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2023.3323562"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s42979-021-00482-2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2019.2918198"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LMAG.2019.2958813"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2018.2869811"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2017.7927047"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CSICC49403.2020.9050077"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2017.2707402"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-25583-0_12"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/0022-3727\/46\/7\/074001"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2024.3382988"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2047073"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/taes.2024.3525448"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2019.2946108"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICSICT.2014.7021415"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401294"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3460809"}],"event":{"name":"2025 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2025,5,25]]},"location":"London, United Kingdom","end":{"date-parts":[[2025,5,28]]}},"container-title":["2025 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11043142\/11042930\/11043354.pdf?arnumber=11043354","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:22:58Z","timestamp":1751091778000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11043354\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5,25]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/iscas56072.2025.11043354","relation":{},"subject":[],"published":{"date-parts":[[2025,5,25]]}}}