{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,8]],"date-time":"2026-01-08T01:25:32Z","timestamp":1767835532827,"version":"3.49.0"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100006190","name":"Research and Development","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006190","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,5,25]]},"DOI":"10.1109\/iscas56072.2025.11043640","type":"proceedings-article","created":{"date-parts":[[2025,6,27]],"date-time":"2025-06-27T17:42:19Z","timestamp":1751046139000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["MTJ based temperature compensated beta multiplier Voltage Reference"],"prefix":"10.1109","author":[{"given":"Yongliang","family":"Zhou","sequence":"first","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Yingxue","family":"Sun","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Jingxue","family":"Zhong","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Chengxing","family":"Dai","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Weizhe","family":"Tan","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Chunyu","family":"Peng","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Xin","family":"Li","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Zhigang","family":"Li","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Zhiting","family":"Lin","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]},{"given":"Xiulong","family":"Wu","sequence":"additional","affiliation":[{"name":"Anhui University,School of Integrated Circuits,HeFei,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7063124"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICICM56102.2022.10011256"},{"key":"ref3","first-page":"1","article-title":"A new low power profile for mixed-signal design of SARADC in Wireless Sensor Network applications","volume-title":"2011 19th Iranian Conference on Electrical Engineering","author":"Roshany"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS54063.2022.9859364"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/PRIME61930.2024.10559712"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ASIC.1994.404520"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/SBMicro60499.2023.10302477"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2024.3425935"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2018.2877446"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3327461"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3260164"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICICS.2018.00016"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2016.7604702"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/EDL.1985.26114"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1971.17207"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10181479"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3088157"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3028506"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3225574"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2654326"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS58744.2024.10557967"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2925266"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3318372"}],"event":{"name":"2025 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"London, United Kingdom","start":{"date-parts":[[2025,5,25]]},"end":{"date-parts":[[2025,5,28]]}},"container-title":["2025 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11043142\/11042930\/11043640.pdf?arnumber=11043640","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:45:21Z","timestamp":1751093121000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11043640\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5,25]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/iscas56072.2025.11043640","relation":{},"subject":[],"published":{"date-parts":[[2025,5,25]]}}}