{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,29]],"date-time":"2025-06-29T04:04:26Z","timestamp":1751169866421,"version":"3.41.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,5,25]]},"DOI":"10.1109\/iscas56072.2025.11043836","type":"proceedings-article","created":{"date-parts":[[2025,6,27]],"date-time":"2025-06-27T17:42:19Z","timestamp":1751046139000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["A 16.42 TOPS\/mm<sup>2<\/sup> Reverse Rotating Charge Sharing DRAM Compute-in-Memory Design in 28nm Process"],"prefix":"10.1109","author":[{"given":"Tsung-Han","family":"Wu","sequence":"first","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics and Electrical Engineering"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Tse","family":"Shih","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics and Electrical Engineering"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hsin-Yung","family":"Fu","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics and Electrical Engineering"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chia Ling","family":"Ho","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics and Electrical Engineering"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wai-Chi","family":"Fang","sequence":"additional","affiliation":[{"name":"Institute of Electronics National Yang Ming Chiao Tung University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ke-Horng","family":"Chen","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics and Electrical Engineering"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kuo-Lin","family":"Zheng","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics and Electrical Engineering"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ying-Hsi","family":"Lin","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corp,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shian-Ru","family":"Lin","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corp,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tsung-Yen","family":"Tsai","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corp,Hsinchu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jui Jen","family":"Wu","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company (TSMC)"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Meng-Fan Marvin","family":"Chang","sequence":"additional","affiliation":[{"name":"Taiwan Semiconductor Manufacturing Company (TSMC)"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2848999"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939682"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365932"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731670"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365766"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2016.7418005"}],"event":{"name":"2025 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2025,5,25]]},"location":"London, United Kingdom","end":{"date-parts":[[2025,5,28]]}},"container-title":["2025 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11043142\/11042930\/11043836.pdf?arnumber=11043836","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:57:06Z","timestamp":1751093826000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11043836\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5,25]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/iscas56072.2025.11043836","relation":{},"subject":[],"published":{"date-parts":[[2025,5,25]]}}}