{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T07:40:01Z","timestamp":1751096401869,"version":"3.41.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,25]],"date-time":"2025-05-25T00:00:00Z","timestamp":1748131200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,5,25]]},"DOI":"10.1109\/iscas56072.2025.11044199","type":"proceedings-article","created":{"date-parts":[[2025,6,27]],"date-time":"2025-06-27T17:42:19Z","timestamp":1751046139000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Design and Analysis of Latch-Type Comparators for Cryogenic Operations"],"prefix":"10.1109","author":[{"given":"Qibang","family":"Zang","sequence":"first","affiliation":[{"name":"Institute of Microelectronics,Agency for Science, Technology and Research (A*STAR),Singapore"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wang Ling","family":"Goh","sequence":"additional","affiliation":[{"name":"Nanyang Technological University (NTU),School of Electrical and Electronic Engineering,Singapore"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Andres","family":"Brito","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics,Agency for Science, Technology and Research (A*STAR),Singapore"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anh Tuan","family":"Do","sequence":"additional","affiliation":[{"name":"Agency for Science, Technology and Research (A*STAR),Quantum Innovation Centre (Q.InC),Singapore"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10181946"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2937234"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3278351"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830355"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2020.3021865"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2043893"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2241799"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2020.3009437"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3199438"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2009.2015207"}],"event":{"name":"2025 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2025,5,25]]},"location":"London, United Kingdom","end":{"date-parts":[[2025,5,28]]}},"container-title":["2025 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11043142\/11042930\/11044199.pdf?arnumber=11044199","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T07:00:05Z","timestamp":1751094005000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11044199\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5,25]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/iscas56072.2025.11044199","relation":{},"subject":[],"published":{"date-parts":[[2025,5,25]]}}}