{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T08:17:57Z","timestamp":1725783477000},"reference-count":31,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,5,19]],"date-time":"2024-05-19T00:00:00Z","timestamp":1716076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,5,19]],"date-time":"2024-05-19T00:00:00Z","timestamp":1716076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,5,19]]},"DOI":"10.1109\/iscas58744.2024.10558044","type":"proceedings-article","created":{"date-parts":[[2024,7,2]],"date-time":"2024-07-02T17:22:52Z","timestamp":1719940972000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Research Experiences for Teachers on Chip Design"],"prefix":"10.1109","author":[{"given":"John","family":"Hu","sequence":"first","affiliation":[{"name":"Oklahoma State University,School of Electrical & Computer Engineering,Stillwater,OK,USA,74078"}]},{"given":"James","family":"Stine","sequence":"additional","affiliation":[{"name":"Oklahoma State University,School of Electrical & Computer Engineering,Stillwater,OK,USA,74078"}]},{"given":"Wooyeol","family":"Choi","sequence":"additional","affiliation":[{"name":"Seoul National University,Dept. of Electrical & Computer Engineering,Seoul,Korea,08826"}]},{"given":"Erin","family":"Dyke","sequence":"additional","affiliation":[{"name":"Oklahoma State University,School of Teaching, Learning and Educational Sciences,Stillwater,OK,USA,74078"}]}],"member":"263","reference":[{"volume-title":"CHIPS: Investments in innovation, resilience, and a more competitive american future","year":"2022","key":"ref1"},{"volume-title":"Workforce Development","year":"2023","key":"ref2"},{"volume-title":"The CHIPS Act Has Already Sparked $200 Billion in Private Investments for U.S. Semiconductor Production","year":"2022","author":"Ravi","key":"ref3"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MSPEC.2023.10147079"},{"key":"ref5","first-page":"1","volume-title":"Chipping In: The U.S. Semiconductor Industry Workforce and How Federal Incentives Will Increase Domestic Jobs","author":"Reid","year":"2021"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/FIE.2010.5673108"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/FIE49875.2021.9637132"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/FIE.2016.7757529"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/FIE.2017.8190676"},{"volume-title":"The NCES Fast Facts Tool provides quick answers to many education questions","key":"ref10"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2820147"},{"volume-title":"GitHub repository","key":"ref12","article-title":"Skywater Open Source PDK"},{"key":"ref13","first-page":"1","article-title":"The missing pieces of open design enablement: a recent history of Google efforts","volume-title":"Proc. Int. Conf. Computer-Aided Design (ICCAD)","author":"Ansell"},{"key":"ref14","article-title":"NSF Integrated Circuit Research, Education, and Workforce Development Workshop Final Report","volume-title":"Tech. Rep.","author":"Guthaus","year":"2022"},{"year":"2023","key":"ref15","article-title":"Introduction to Siliwiz"},{"year":"2023","key":"ref16","article-title":"Wowki \u2013 Online ESP32, STM32, Arduino Simulator"},{"volume-title":"Fundamentals of Microelectronics","year":"2021","author":"Razavi","key":"ref17"},{"key":"ref18","article-title":"SPICE (Simulation Program with Integrated Circuit Emphasis)","volume-title":"Tech. Rep. Memorandum No. ERL-M382","author":"Nagel","year":"1973"},{"volume-title":"Analog Devices","key":"ref19","article-title":"LTspice Information Center"},{"volume-title":"VEX IQ robotics competition","key":"ref20"},{"key":"ref21","article-title":"NGSPICE: open-source spice simulator"},{"key":"ref22","article-title":"ADALM1000 overview","volume-title":"Analog Devices","author":"Mercier","year":"2021"},{"key":"ref23","article-title":"ADALM1000 hardware manual","volume-title":"Analog Devices","author":"Velasco","year":"2023"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.18251\/ijme.v22i2.2445"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.4135\/9781506355382"},{"article-title":"Introducing a workforce development curriculum for Oklahoma in semiconductor manufacturing and IC design","volume-title":"2023 ASEE Annu. Conf","author":"Kaya","key":"ref26"},{"article-title":"Transistor technology: Past, Present, and Future","volume-title":"2023 ASEE Annu. Conf","author":"Hossain","key":"ref27"},{"article-title":"How to apply semiconductor technology to Northern Oklahoma College","volume-title":"2023 ASEE Annu. Conf","author":"Miller","key":"ref28"},{"article-title":"Employment in the semiconductor industry","volume-title":"2023 ASEE Annu. Conf","author":"Sherwood","key":"ref29"},{"volume-title":"Inquiry as stance: Practitioner research for the next generation","year":"2015","author":"Cochran-Smith","key":"ref30"},{"volume-title":"Constructing grounded theory: A practical guide through qualitative analysis","year":"2006","author":"Charmaz","key":"ref31"}],"event":{"name":"2024 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2024,5,19]]},"location":"Singapore, Singapore","end":{"date-parts":[[2024,5,22]]}},"container-title":["2024 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10557746\/10557828\/10558044.pdf?arnumber=10558044","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,7,3]],"date-time":"2024-07-03T06:17:07Z","timestamp":1719987427000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10558044\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5,19]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/iscas58744.2024.10558044","relation":{},"subject":[],"published":{"date-parts":[[2024,5,19]]}}}