{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T15:34:28Z","timestamp":1780673668335,"version":"3.54.1"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,5,19]],"date-time":"2024-05-19T00:00:00Z","timestamp":1716076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,5,19]],"date-time":"2024-05-19T00:00:00Z","timestamp":1716076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100007225","name":"Ministry of Science and Technology","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100007225","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,5,19]]},"DOI":"10.1109\/iscas58744.2024.10558360","type":"proceedings-article","created":{"date-parts":[[2024,7,2]],"date-time":"2024-07-02T17:22:52Z","timestamp":1719940972000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["Q-learning Assisted LASSO-based Thermal Sensor Placement for Thermal-aware Multi-core Systems"],"prefix":"10.1109","author":[{"given":"Kun-Chih Jimmy","family":"Chen","sequence":"first","affiliation":[{"name":"National Yang Ming Chiao Tung University,Institute of Electronics,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lei-Qi","family":"Wang","sequence":"additional","affiliation":[{"name":"National Sun Yat-sen University,Department of Computer Science and Engineering,Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICM.2008.5393510"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CONECCT.2014.6740182"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2020.2982629"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS48785.2022.9937286"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.45"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2019.2903017"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2015.2395423"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS.2016.7803935"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3143476"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS48785.2022.9937996"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICACA.2016.7887916"},{"key":"ref12","first-page":"343","article-title":"Using fast and accurate simulation to explore hardware\/software trade-offs in the multi-core era","author":"Heirman","year":"2012","journal-title":"Applications, Tools and Techniques on the Road to Exascale Computing"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JCN.2013.000083"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1111\/j.2517-6161.1996.tb02080.x"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1155\/2021\/1776805"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2941229"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1023\/A:1017936530646"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/BF00992698"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/140901.141896"}],"event":{"name":"2024 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Singapore, Singapore","start":{"date-parts":[[2024,5,19]]},"end":{"date-parts":[[2024,5,22]]}},"container-title":["2024 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10557746\/10557828\/10558360.pdf?arnumber=10558360","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,7,3]],"date-time":"2024-07-03T08:00:46Z","timestamp":1719993646000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10558360\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5,19]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/iscas58744.2024.10558360","relation":{},"subject":[],"published":{"date-parts":[[2024,5,19]]}}}