{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,1]],"date-time":"2025-11-01T09:36:20Z","timestamp":1761989780767,"version":"3.28.0"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,5,19]],"date-time":"2024-05-19T00:00:00Z","timestamp":1716076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,5,19]],"date-time":"2024-05-19T00:00:00Z","timestamp":1716076800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,5,19]]},"DOI":"10.1109\/iscas58744.2024.10558544","type":"proceedings-article","created":{"date-parts":[[2024,7,2]],"date-time":"2024-07-02T17:22:52Z","timestamp":1719940972000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["Curriculum Development for Tapeout-Ready Mixed-Signal System-on-Chip Design and Assembly"],"prefix":"10.1109","author":[{"given":"Samuel J.","family":"Murray","sequence":"first","affiliation":[{"name":"University of Nebraska–Lincoln,Department of Electrical and Computer Engineering,Lincoln,NE,USA,68588"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Joseph A.","family":"Schmitz","sequence":"additional","affiliation":[{"name":"University of Nebraska–Lincoln,Department of Electrical and Computer Engineering,Lincoln,NE,USA,68588"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sina","family":"Balk\u0131r","sequence":"additional","affiliation":[{"name":"University of Nebraska–Lincoln,Department of Electrical and Computer Engineering,Lincoln,NE,USA,68588"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michael W.","family":"Hoffman","sequence":"additional","affiliation":[{"name":"University of Nebraska–Lincoln,Department of Electrical and Computer Engineering,Lincoln,NE,USA,68588"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"issue":"01","key":"ref1","first-page":"52","article-title":"Energy and power efficient system on chip with nanosheet FET","volume":"1","author":"Kumar","year":"2019","journal-title":"Journal of Electronics"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3745\/JIPS.03.0129"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/te.2010.2050773"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/3299874.3318000"},{"volume-title":"FreePDK45","author":"Davis","key":"ref5"},{"volume-title":"Oklahoma State University system on chip (SoC) design flows","author":"Castellanos","key":"ref6"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/socc.2012.6398371"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-23049-4"},{"volume-title":"Modern System-on-Chip Design on ARM.","year":"2021","author":"Greaves","key":"ref9"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/jsen.2023.3289914"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tns.2023.3241582"}],"event":{"name":"2024 IEEE International Symposium on Circuits and Systems (ISCAS)","start":{"date-parts":[[2024,5,19]]},"location":"Singapore, Singapore","end":{"date-parts":[[2024,5,22]]}},"container-title":["2024 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10557746\/10557828\/10558544.pdf?arnumber=10558544","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,7,3]],"date-time":"2024-07-03T07:42:36Z","timestamp":1719992556000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10558544\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5,19]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/iscas58744.2024.10558544","relation":{},"subject":[],"published":{"date-parts":[[2024,5,19]]}}}