{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:55:08Z","timestamp":1781848508341,"version":"3.54.5"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562037","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"4340-4344","source":"Crossref","is-referenced-by-count":0,"title":["Step-Down DC-DC Converters with Transient Enhancement Technique Based on Active Compensation for Large-Load Applications"],"prefix":"10.1109","author":[{"given":"Xiao","family":"Shu","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,School of Integrated Circuits,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hiu Fung","family":"Fok","sequence":"additional","affiliation":[{"name":"Huawei Hong Kong Research Center,Hong Kong,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bohang","family":"Zheng","sequence":"additional","affiliation":[{"name":"HiSilicon Technologies Co., Limited,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Liang","family":"Zhou","sequence":"additional","affiliation":[{"name":"HiSilicon Technologies Co., Limited,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yong","family":"Zhou","sequence":"additional","affiliation":[{"name":"Huawei Hong Kong Research Center,Hong Kong,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jianjun","family":"Zhou","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,School of Integrated Circuits,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3052198"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2405093"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3223680"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/iscas56072.2025.11044125"},{"key":"ref5","article-title":"Loop response considerations in peak current mode buck converter design","volume-title":"ti.com","author":"Zhang"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562037.pdf?arnumber=11562037","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:50:02Z","timestamp":1781848202000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562037\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562037","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}