{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:48Z","timestamp":1781848428709,"version":"3.54.5"},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562089","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"459-463","source":"Crossref","is-referenced-by-count":0,"title":["RRAM-based CAM for Energy-Efficient In-Memory Text Compression System"],"prefix":"10.1109","author":[{"given":"Lianliang","family":"Wu","sequence":"first","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hao","family":"Ai","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yiyang","family":"Chen","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ao","family":"Shi","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Siyuan","family":"Chen","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haokai","family":"Guan","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Nan","family":"Tang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yi","family":"Xiao","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kexun","family":"Li","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kefan","family":"Tao","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yulin","family":"Feng","sequence":"additional","affiliation":[{"name":"Beijing Information Science and Technology University,College of Instrument Science and Opto-Electronics Engineering,Beijing,China,100192"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zongwei","family":"Wang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yimao","family":"Cai","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Peng","family":"Huang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/comst.2024.3465447"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/comst.2025.3564333"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3637528.3671470"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tit.1977.1055714"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/icecs.2015.7440278"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ccwc.2019.8666521"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/5.892708"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3231935"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/iscas.2016.7527507"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.isci.2023.108371"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/12.888055"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/vlsid.2007.34"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662395"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9062953"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185424"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454468"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310400"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067610"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/irps48204.2025.10983332"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2021.3054972"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562089.pdf?arnumber=11562089","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:39:16Z","timestamp":1781847556000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562089\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562089","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}