{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:54:22Z","timestamp":1781848462302,"version":"3.54.5"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562122","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"3536-3540","source":"Crossref","is-referenced-by-count":0,"title":["A 5MHz-Bandwidth CMOS Hall Current Sensor with Non-spun Voltage-biased Hall Plates and SAR-Accumulator Offset Calibration"],"prefix":"10.1109","author":[{"given":"Yizhen","family":"Chen","sequence":"first","affiliation":[{"name":"Fudan University,Key Laboratory of Integrated Chip and Systems, School of Microelectronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haoming","family":"Luo","sequence":"additional","affiliation":[{"name":"Fudan University,Key Laboratory of Integrated Chip and Systems, School of Microelectronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hong","family":"Chen","sequence":"additional","affiliation":[{"name":"Inbisen Semiconductor Co. Ltd.,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ye","family":"Zheng","sequence":"additional","affiliation":[{"name":"Inbisen Semiconductor Co. Ltd.,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yinuo","family":"Chen","sequence":"additional","affiliation":[{"name":"Fudan University,Key Laboratory of Integrated Chip and Systems, School of Microelectronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jinhang","family":"Sun","sequence":"additional","affiliation":[{"name":"Fudan University,Key Laboratory of Integrated Chip and Systems, School of Microelectronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junyu","family":"Wang","sequence":"additional","affiliation":[{"name":"Fudan University,Key Laboratory of Integrated Chip and Systems, School of Microelectronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Rui","family":"Yin","sequence":"additional","affiliation":[{"name":"Fudan University,Key Laboratory of Integrated Chip and Systems, School of Microelectronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3136871"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3156572"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3468955"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2685462"},{"key":"ref5","volume-title":"ACS37030 and ACS37032, Allegro"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067677"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2909161"},{"issue":"1","key":"ref8","first-page":"743","article-title":"A low-offset spinning-current Hall plate","volume-title":"Sensors and Actuators A: Physical","volume":"22","author":"Munter","year":"1990"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2023.3284055"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2013.6649111"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2143610"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746303"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1201\/NOE0750308557"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365767"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562122.pdf?arnumber=11562122","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:44:41Z","timestamp":1781847881000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562122\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562122","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}