{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T06:50:57Z","timestamp":1781851857872,"version":"3.54.5"},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562150","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"2298-2302","source":"Crossref","is-referenced-by-count":0,"title":["A 185 dB FoM\n                    <sub>S<\/sub>\n                    Direct-Integration Third-Order Passive Noise-Shaping SAR ADC for Biomedical Applications"],"prefix":"10.1109","author":[{"given":"Kangkang","family":"Sun","sequence":"first","affiliation":[{"name":"Sun Yat-sen University,School of Electronics and Communication Engineering,Shenzhen,China,518107"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kailin","family":"Lin","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Electronics and Communication Engineering,Shenzhen,China,518107"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Weijie","family":"Ge","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Electronics and Communication Engineering,Shenzhen,China,518107"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Feng","family":"Yan","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Electronics and Communication Engineering,Shenzhen,China,518107"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bingjun","family":"Xiong","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Electronics and Communication Engineering,Shenzhen,China,518107"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jian","family":"Guan","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Electronics and Communication Engineering,Shenzhen,China,518107"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jingjing","family":"Liu","sequence":"additional","affiliation":[{"name":"Sun Yat-sen University,School of Electronics and Communication Engineering,Shenzhen,China,518107"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/tbcas.2023.3272649"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2025.3559669"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2018.2859837"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/biocas61083.2024.10798387"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tbcas.2023.3312976"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/tbcas.2025.3557241"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2015.7231329"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ojsscs.2021.3119910"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2900150"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2024.3447740"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3111912"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2023.3307189"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/asscc.2008.4708780"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067844"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2024.3430378"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/iscas56072.2025.11044022"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/iscas58744.2024.10557948"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562150.pdf?arnumber=11562150","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:22Z","timestamp":1781848402000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562150\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562150","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}