{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:46Z","timestamp":1781848426520,"version":"3.54.5"},"reference-count":11,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562177","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"2293-2297","source":"Crossref","is-referenced-by-count":0,"title":["A 16- ENOB 2nd order Noise-Shaping SAR ADC with Mismatch Error Shaping and Optimized Switch Charge Injection Balancing"],"prefix":"10.1109","author":[{"given":"Ziang","family":"Shen","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yang","family":"Zhao","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yong","family":"Lian","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-024-4196-0"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062905"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366008"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454362"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365990"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3199241"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3019487"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/82.476173"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2592623"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3137540"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3168588"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562177.pdf?arnumber=11562177","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:38:29Z","timestamp":1781847509000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562177\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562177","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}