{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:52:58Z","timestamp":1781848378947,"version":"3.54.5"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562339","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"415-419","source":"Crossref","is-referenced-by-count":0,"title":["An Efficient Fully-Pipelined Hardware Architecture for Optimized Sparse Polynomial Multiplication in CRYSTALS-Dilithium"],"prefix":"10.1109","author":[{"given":"Zhengwei","family":"Wang","sequence":"first","affiliation":[{"name":"Nanjing University of Aeronautics and Astronautics,College of Integrated Circuits,Nanjing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bei","family":"Wang","sequence":"additional","affiliation":[{"name":"Nanjing University of Aeronautics and Astronautics,College of Integrated Circuits,Nanjing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zeren","family":"Zhu","sequence":"additional","affiliation":[{"name":"Nanjing University of Aeronautics and Astronautics,College of Integrated Circuits,Nanjing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chenghua","family":"Wang","sequence":"additional","affiliation":[{"name":"Nanjing University of Aeronautics and Astronautics,College of Integrated Circuits,Nanjing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yijun","family":"Cui","sequence":"additional","affiliation":[{"name":"Nanjing University of Aeronautics and Astronautics,College of Integrated Circuits,Nanjing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Weiqiang","family":"Liu","sequence":"additional","affiliation":[{"name":"Nanjing University of Aeronautics and Astronautics,College of Integrated Circuits,Nanjing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"Quantum Cryptography","author":"Grimes","year":"2020"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.6028\/nist.ir.8105"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.6028\/nist.ir.8413-upd1"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICFPT52863.2021.9609917"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3274599"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3649476.3658794"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.46586\/tches.v2022.i1.270-295"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-97348-3_12"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/HOST55342.2024.10545379"},{"key":"ref10","article-title":"CRYSTALS-Dilithium: Algorithm specifications and supporting documentation (version 3.1)","volume":"3","author":"Bai","year":"2021","journal-title":"Submission to the NIST Post-Quantum Cryptography Standardization Process, Round"},{"key":"ref11","article-title":"CRYSTALS - Dilithium: Digital Signatures from Module Lattices","author":"Ducas","year":"2017","journal-title":"IACR Cryptol. ePrint Arch."},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2020.3045904"},{"key":"ref13","article-title":"Module-Lattice-Based Digital Signature Standard (ML-DSA)","volume-title":"FIPS 204","year":"2024"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.46586\/tches.v2020.i2.49-72"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-57682-0"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-89912-7_3"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-662-44709-3_20"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2022.3144101"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562339.pdf?arnumber=11562339","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:29:49Z","timestamp":1781846989000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562339\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562339","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}