{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:46Z","timestamp":1781848426970,"version":"3.54.5"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562348","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"664-668","source":"Crossref","is-referenced-by-count":0,"title":["A Multi-rate 2-2 DT-CT MASH DSM Using an Embedded LPF for Easy-Driving"],"prefix":"10.1109","author":[{"given":"Qingxun","family":"Wang","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,School of Integrated Circuits,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ziqiang","family":"Cai","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,School of Integrated Circuits,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Rui","family":"Feng","sequence":"additional","affiliation":[{"name":"East China Institute of Photo-Electron IC,Suzhou,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yinglong","family":"Ding","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,School of Integrated Circuits,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Liang","family":"Qi","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,School of Integrated Circuits,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3186788"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3153786"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-021-3401-6"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2025.3607443"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3190446"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2025.3538493"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS60917.2024.10658689"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2942359"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2693921"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401444"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2019.2928591"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7418015"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3082943"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2017.7993658"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3064422"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC53895.2021.9634767"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1002\/9781119258308"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2557809"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/CICC60959.2024.10529065"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3255866"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2025.3596608"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562348.pdf?arnumber=11562348","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:38:19Z","timestamp":1781847499000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562348\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562348","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}