{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:03Z","timestamp":1781848383618,"version":"3.54.5"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562388","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"4385-4389","source":"Crossref","is-referenced-by-count":0,"title":["A 16-phase High Frequency Integrated Voltage Regulator with On-chip Current Sensing and Smooth Phase Shedding\/Adding"],"prefix":"10.1109","author":[{"given":"Chi","family":"Zhang","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shaowei","family":"Zhen","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zuyue","family":"Pang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chenguang","family":"Lv","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuhai","family":"Chen","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaohuan","family":"You","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ziyi","family":"Cui","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Luhao","family":"Cha","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bo","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/pesc.2004.1354830"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/APEX.2007.357595"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2018.8623899"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870398"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2014.6803344"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731658"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365957"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2019.8722207"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC60305.2024.10849005"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3407531"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830282"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3193712"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562388.pdf?arnumber=11562388","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:30:31Z","timestamp":1781847031000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562388\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562388","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}