{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T06:50:42Z","timestamp":1781851842356,"version":"3.54.5"},"reference-count":16,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562428","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"1729-1733","source":"Crossref","is-referenced-by-count":0,"title":["A Membrane Potential Communication-based Network-on-chip for Merge-core-free Spiking Neural Network Deployment"],"prefix":"10.1109","author":[{"given":"Weilai","family":"Chu","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhantao","family":"Liu","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chongyang","family":"Li","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Youming","family":"Liu","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chenyang","family":"Liu","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pujun","family":"Zhou","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guanchao","family":"Qiao","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shaogang","family":"Hu","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,State Key Laboratory of Electronic Thin Films and Integrated Devices"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3330483"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/BioCAS58349.2023.10389111"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2025.3603002"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3323837"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS56072.2025.11043533"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP40776.2020.9053914"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3507095"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR42600.2020.01357"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC48613.2020.9336142"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3112979"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICCE62051.2024.10634604"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3409652"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2022.3209073"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2970709"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2018.112130359"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2474396"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562428.pdf?arnumber=11562428","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:52:13Z","timestamp":1781848333000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562428\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562428","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}