{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:17Z","timestamp":1781848397742,"version":"3.54.5"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100018537","name":"National Science and Technology Major Project","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100018537","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012228","name":"Development and Reform Commission of Shenzhen Municipality","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012228","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562444","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"4444-4448","source":"Crossref","is-referenced-by-count":0,"title":["A Low Noise Bio-potential AFE Achieving 300-mV EDO Tolerance and <20-ms-Settling with VCO-based Full Digital DC Servo Loop"],"prefix":"10.1109","author":[{"given":"Shengping","family":"Lv","sequence":"first","affiliation":[{"name":"Tsinghua University,School of Integrated Circuits,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guanzhe","family":"Hu","sequence":"additional","affiliation":[{"name":"Tsinghua University,School of Integrated Circuits,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Liuxin","family":"Lv","sequence":"additional","affiliation":[{"name":"Tsinghua University,School of Integrated Circuits,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Peng","family":"Zhang","sequence":"additional","affiliation":[{"name":"HexinHulian Technology (Beijing) Co.,Ltd,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fei","family":"Chen","sequence":"additional","affiliation":[{"name":"Research Institute of Tsinghua University in Shenzhen,Greater Bay Area National Center of Technology Innovation,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wen","family":"Jia","sequence":"additional","affiliation":[{"name":"Research Institute of Tsinghua University in Shenzhen,Greater Bay Area National Center of Technology Innovation,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuqiang","family":"Lu","sequence":"additional","affiliation":[{"name":"Beijing Jixieji Technology Co., Ltd,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhihua","family":"Wang","sequence":"additional","affiliation":[{"name":"Tsinghua University,School of Integrated Circuits,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hanjun","family":"Jiang","sequence":"additional","affiliation":[{"name":"Tsinghua University,School of Integrated Circuits,Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/EMBC46164.2021.9630245"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/s19091991"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2143610"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2020.3038632"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8351075"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS58744.2024.10558622"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.908664"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2225738"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2163552"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS58744.2024.10558664"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3010816"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS58744.2024.10557920"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2024.3523963"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562444.pdf?arnumber=11562444","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:32:57Z","timestamp":1781847177000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562444\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562444","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}