{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T06:50:33Z","timestamp":1781851833293,"version":"3.54.5"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562486","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"3421-3425","source":"Crossref","is-referenced-by-count":0,"title":["An Area-Efficient Neural Stimulator Chip Achieving 23V Voltage Compliance by 180nm BCD CMOS process"],"prefix":"10.1109","author":[{"given":"Zherui","family":"Li","sequence":"first","affiliation":[{"name":"Zhejiang University,College of Integrated Circuits,Hangzhou,China,311200"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Cheng","family":"Han","sequence":"additional","affiliation":[{"name":"Zhejiang University,College of Integrated Circuits,Hangzhou,China,311200"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qijing","family":"Xiao","sequence":"additional","affiliation":[{"name":"Zhejiang University,College of Integrated Circuits,Hangzhou,China,311200"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Weixiao","family":"Wang","sequence":"additional","affiliation":[{"name":"Zhejiang University,College of Integrated Circuits,Hangzhou,China,311200"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yunshan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Zhejiang University,College of Integrated Circuits,Hangzhou,China,311200"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jun","family":"Zhou","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,611731"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bo","family":"Zhao","sequence":"additional","affiliation":[{"name":"Zhejiang University,College of Integrated Circuits,Hangzhou,China,311200"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.clinph.2004.05.031"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jneumeth.2004.10.020"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1088\/1741-2560\/8\/6\/066008"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2017.2713122"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EMBC48229.2022.9871563"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2014.2368788"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2014.2387679"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3108578"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC59616.2023.10268749"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2828823"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2024.3391190"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/cicc51472.2021.9431493"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067626"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3503914"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562486.pdf?arnumber=11562486","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:50:55Z","timestamp":1781848255000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562486\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562486","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}