{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:55:12Z","timestamp":1781848512478,"version":"3.54.5"},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562657","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"2818-2822","source":"Crossref","is-referenced-by-count":0,"title":["DyNeuro: A Hybrid Neuromorphic Accelerator with Dynamic Spatio-Temporal Variation Adaptations"],"prefix":"10.1109","author":[{"given":"Youming","family":"Yang","sequence":"first","affiliation":[{"name":"Peking University,Key Laboratory of Microelectronic Devices and Circuits, MPW Center (MoE), School of Integrated Circuits"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yi","family":"Zhong","sequence":"additional","affiliation":[{"name":"Peking University,Key Laboratory of Microelectronic Devices and Circuits, MPW Center (MoE), School of Integrated Circuits"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Li","family":"Lun","sequence":"additional","affiliation":[{"name":"Peking University,Key Laboratory of Microelectronic Devices and Circuits, MPW Center (MoE), School of Integrated Circuits"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tao","family":"Zhang","sequence":"additional","affiliation":[{"name":"Peking University,Key Laboratory of Microelectronic Devices and Circuits, MPW Center (MoE), School of Integrated Circuits"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaoxin","family":"Cui","sequence":"additional","affiliation":[{"name":"Peking University,Key Laboratory of Microelectronic Devices and Circuits, MPW Center (MoE), School of Integrated Circuits"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuan","family":"Wang","sequence":"additional","affiliation":[{"name":"Peking University,Key Laboratory of Microelectronic Devices and Circuits, MPW Center (MoE), School of Integrated Circuits"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/cvpr52734.2025.01304"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1609\/aaai.v39i17.34013"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1088\/2634-4386\/adb070"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-024-08253-8"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2020.2970709"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067497"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454330"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067360"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49661.2025.10904594"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662302"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3066572"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/321420.321422"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/cicc60959.2024.10529086"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067269"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/iccv48922.2021.01006"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/iscas56072.2025.11043929"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/iscas56072.2025.11043330"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2024.3426319"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2024.3507095"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/iscas58744.2024.10557924"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562657.pdf?arnumber=11562657","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:50:25Z","timestamp":1781848225000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562657\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562657","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}