{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:52Z","timestamp":1781848432515,"version":"3.54.5"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562926","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"2193-2197","source":"Crossref","is-referenced-by-count":0,"title":["A Multiplication-Free Floating-Point CIM Architecture with a 5-Bit Approximate Squaring Circuit"],"prefix":"10.1109","author":[{"given":"Xin","family":"Li","sequence":"first","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Juntao","family":"Ge","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Miao","family":"Long","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fugui","family":"Jiang","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chenglong","family":"Duan","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yang","family":"Yang","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wenqiang","family":"Zhang","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yu","family":"Liu","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Beibei","family":"Zhang","sequence":"additional","affiliation":[{"name":"Hefei Microelectronics Research Institute Co. LTD,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhiting","family":"Lin","sequence":"additional","affiliation":[{"name":"Anhui University,Hefei,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662419"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502421"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365984"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3280357"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3341608"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3061260"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3108344"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3031290"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3061508"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067360"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir57934.2023.10185399"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3273238"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067779"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492476"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067527"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731762"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC59616.2023.10268770"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067527"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3363871"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49661.2025.10904702"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS58744.2024.10558433"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562926.pdf?arnumber=11562926","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:40:06Z","timestamp":1781847606000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562926\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562926","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}