{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:53:06Z","timestamp":1781848386547,"version":"3.54.5"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,24]],"date-time":"2026-05-24T00:00:00Z","timestamp":1779580800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,24]]},"DOI":"10.1109\/iscas66217.2026.11562954","type":"proceedings-article","created":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T20:06:41Z","timestamp":1781813201000},"page":"4345-4349","source":"Crossref","is-referenced-by-count":0,"title":["A Symmetrical RHP-Zero-Free Hybrid Boost Converter With Eliminated Flying Capacitor Inrush Current and Enhanced Output Current Continuity"],"prefix":"10.1109","author":[{"given":"Zhitong","family":"Chen","sequence":"first","affiliation":[{"name":"Northwestern Polytechnical University,School of Software,Xi’an,China,710072"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junyi","family":"Liu","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University,School of Integrated Circuits,Xi’an,China,710072"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xingyuan","family":"Niu","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University,School of Integrated Circuits,Xi’an,China,710072"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yudi","family":"Ren","sequence":"additional","affiliation":[{"name":"Xi’an Aerosemi Technology,Xi’an,China,710077"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaoya","family":"Fan","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University,School of Software,Xi’an,China,710072"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanzhao","family":"Ma","sequence":"additional","affiliation":[{"name":"Northwestern Polytechnical University,School of Integrated Circuits,Xi’an,China,710072"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2025.3580499"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3364379"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3293829"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3269026"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3289910"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2025.3618100"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2949653"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2019.8902720"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454511"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/tpel.2021.3106862"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS48785.2022.9938016"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10182217"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC60305.2024.10848668"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2025.3551087"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2019.8885261"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2854370"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2954109"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2024.3376251"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3182145"}],"event":{"name":"2026 IEEE International Symposium on Circuits and Systems (ISCAS)","location":"Shanghai, China","start":{"date-parts":[[2026,5,24]]},"end":{"date-parts":[[2026,5,28]]}},"container-title":["2026 IEEE International Symposium on Circuits and Systems (ISCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11561899\/11561804\/11562954.pdf?arnumber=11562954","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T05:31:17Z","timestamp":1781847077000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11562954\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,24]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/iscas66217.2026.11562954","relation":{},"subject":[],"published":{"date-parts":[[2026,5,24]]}}}