{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T03:23:47Z","timestamp":1725593027391},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,3]]},"DOI":"10.1109\/isdcs.2019.8719253","type":"proceedings-article","created":{"date-parts":[[2019,5,24]],"date-time":"2019-05-24T02:32:06Z","timestamp":1558665126000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Analysis of Embedded-Diode Performance in MOSFET under Switching Condition"],"prefix":"10.1109","author":[{"given":"Takao","family":"Yamamoto","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yukiya","family":"Fukunaga","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daisaku","family":"Ikoma","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mitiko","family":"Miura-Mattausch","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dondee","family":"Navarro","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hans Juergen","family":"Mattausch","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/WiPDA.2016.7799913"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/16.992876"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2278919"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2477413"},{"journal-title":"Power Microelectronics Device and Process Technologies","year":"0","author":"yung chii","key":"ref14"},{"key":"ref4","article-title":"Vehicles in The 21st Century and Electrical Engineering. 2. Status and Future View of Automotive Power Supply","author":"teratani","year":"2001","journal-title":"2nd International Congress on"},{"key":"ref3","first-page":"1369","author":"borojevic","year":"2010","journal-title":"Proc of the Optimization of Electrical and Electronic Equipment Conf"},{"key":"ref6","article-title":"Energy-saving Technologies for Automobiles","author":"teratani","year":"2006","journal-title":"Technical Report 1049 IEEJ"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2004.1346482"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2010.2048292"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/WCT.2004.240285"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2010.2081330"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MPEL.2014.2330459"},{"key":"ref9","first-page":"1","article-title":"Characterization, Mission Profile Analysis and Calorimetric Loss Measurement of a SiC Hybrid Module for Main Inverter Application of Electric Vehicles","author":"poonjal pai","year":"2017","journal-title":"2017 IEEE International Workshop on Integrated Power Packaging"}],"event":{"name":"2019 2nd International Symposium on Devices, Circuits and Systems (ISDCS)","start":{"date-parts":[[2019,3,6]]},"location":"Higashi-Hiroshima, Japan","end":{"date-parts":[[2019,3,8]]}},"container-title":["2019 2nd International Symposium on Devices, Circuits and Systems (ISDCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8716490\/8719086\/08719253.pdf?arnumber=8719253","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,17]],"date-time":"2022-07-17T21:55:57Z","timestamp":1658094957000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8719253\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/isdcs.2019.8719253","relation":{},"subject":[],"published":{"date-parts":[[2019,3]]}}}