{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T01:38:34Z","timestamp":1740101914751,"version":"3.37.3"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,29]],"date-time":"2023-05-29T00:00:00Z","timestamp":1685318400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,29]],"date-time":"2023-05-29T00:00:00Z","timestamp":1685318400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004721","name":"University of Tokyo","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004721","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5,29]]},"DOI":"10.1109\/isdcs58735.2023.10153569","type":"proceedings-article","created":{"date-parts":[[2023,6,20]],"date-time":"2023-06-20T17:22:33Z","timestamp":1687281753000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Temperature Sensor Circuit for a Wearable Perspiration Monitoring System"],"prefix":"10.1109","author":[{"given":"Yuichiro","family":"Ichimura","sequence":"first","affiliation":[{"name":"Graduate School of Science and Technology Shinshu University,Electrical and Computer Engineering Division,Department of Engineering,Nagano,Japan"}]},{"given":"Kenta","family":"Goto","sequence":"additional","affiliation":[{"name":"Shinshu University,Faculty of Engineering,Department of Electrical and Computer Engineering,Nagano,Japan"}]},{"given":"Koh","family":"Johguchi","sequence":"additional","affiliation":[{"name":"Shinshu University,Faculty of Engineering,Department of Electrical and Computer Engineering,Nagano,Japan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1299\/jsmermd.2008._1a1-i02_1"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.7567\/SSDM.2017.F-1-05"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.57.04FF10"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISDCS.2019.8719102"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.7567\/ssdm.2022.k-2-03"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.35848\/1347-4065\/acb659"}],"event":{"name":"2023 International Symposium on Devices, Circuits and Systems (ISDCS)","start":{"date-parts":[[2023,5,29]]},"location":"Higashihiroshima, Japan","end":{"date-parts":[[2023,5,31]]}},"container-title":["2023 International Symposium on Devices, Circuits and Systems (ISDCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10153534\/10153516\/10153569.pdf?arnumber=10153569","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T10:37:48Z","timestamp":1709289468000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10153569\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5,29]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isdcs58735.2023.10153569","relation":{},"subject":[],"published":{"date-parts":[[2023,5,29]]}}}