{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T07:50:51Z","timestamp":1730274651250,"version":"3.28.0"},"reference-count":21,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,6]]},"DOI":"10.1109\/isie.2017.8001578","type":"proceedings-article","created":{"date-parts":[[2017,8,9]],"date-time":"2017-08-09T16:27:37Z","timestamp":1502296057000},"page":"2089-2092","source":"Crossref","is-referenced-by-count":1,"title":["Device modelling of silicon based high-performance flexible electronics"],"prefix":"10.1109","author":[{"given":"Shoubhik","family":"Gupta","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anastasios","family":"Vilouras","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hadi","family":"Heidari","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ravinder","family":"Dahiya","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2016.2575802"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609286"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/16.944190"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/16.137323"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-7276-7_21"},{"key":"ref15","article-title":"A new MOSFET model for the simulation of circuits under mechanical stress","author":"alius","year":"2014","journal-title":"Proc MOS-AK Workshop"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.200800306"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2668899"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1063\/1.3184579"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2013.02.007"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1080\/01691864.2015.1095653"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TRO.2009.2033627"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/2058-8585\/aa5ab2"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-42324-1_28"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2016.7527501"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2013.2269028"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ESSDERC.2014.6948764"},{"key":"ref1","article-title":"Energy autonomous flexible and transparent tactile skin","volume":"1606287","author":"n\u00fa\u00f1ez","year":"2017","journal-title":"Advanced Functional Materials"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.proeng.2016.11.242"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2016.7527241"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2615108"}],"event":{"name":"2017 IEEE 26th International Symposium on Industrial Electronics (ISIE)","start":{"date-parts":[[2017,6,19]]},"location":"Edinburgh, United Kingdom","end":{"date-parts":[[2017,6,21]]}},"container-title":["2017 IEEE 26th International Symposium on Industrial Electronics (ISIE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7994774\/8000791\/08001578.pdf?arnumber=8001578","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,8,23]],"date-time":"2017-08-23T19:42:47Z","timestamp":1503517367000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8001578\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,6]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/isie.2017.8001578","relation":{},"subject":[],"published":{"date-parts":[[2017,6]]}}}