{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T07:49:59Z","timestamp":1730274599012,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,6,1]],"date-time":"2022-06-01T00:00:00Z","timestamp":1654041600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,1]],"date-time":"2022-06-01T00:00:00Z","timestamp":1654041600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,6,1]]},"DOI":"10.1109\/isie51582.2022.9831623","type":"proceedings-article","created":{"date-parts":[[2022,7,25]],"date-time":"2022-07-25T20:19:13Z","timestamp":1658780353000},"page":"558-563","source":"Crossref","is-referenced-by-count":0,"title":["Input DC-link Capacitor Design and Thermal Considerations for a Voltage Source Inverter Using the Approach of Switching Functions"],"prefix":"10.1109","author":[{"given":"Ayodhya Somiruwan","family":"Gamwari","sequence":"first","affiliation":[{"name":"University of Maryland,The Institute for Systems Research and Department of Electrical and Computer Engineering,College Park,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chanaka","family":"Singhabahu","sequence":"additional","affiliation":[{"name":"University of Maryland,The Institute for Systems Research and Department of Electrical and Computer Engineering,College Park,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rakesh","family":"Resalayyan","sequence":"additional","affiliation":[{"name":"University of Maryland,The Institute for Systems Research and Department of Electrical and Computer Engineering,College Park,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yongwan","family":"Park","sequence":"additional","affiliation":[{"name":"University of Maryland,The Institute for Systems Research and Department of Electrical and Computer Engineering,College Park,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alireza","family":"Khaligh","sequence":"additional","affiliation":[{"name":"University of Maryland,The Institute for Systems Research and Department of Electrical and Computer Engineering,College Park,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2988011"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3104759"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2021.3053884"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3070078"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.3025740"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPWRD.2014.2340870"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2296774"},{"issue":"3","key":"ref8","doi-asserted-by":"crossref","first-page":"1974","DOI":"10.1109\/TIA.2013.2286215","article-title":"Grid-connected vsi with |inline-formula? itex-math notation=\u201ctex\u201d,? lcli \/tex-math ? i\/inline-formula?.filter-models and comparison","volume":"50","author":"Hoff","year":"2014","journal-title":"IEEE Transactions on Industry Applications"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2620442"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IECON.2014.7049278"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3117633"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/41.915410"},{"article-title":"Film capacitors: general technical information","volume-title":"TDK Corp.","year":"2018","key":"ref13"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISdea.2012.554"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2018.2851068"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/IECON43393.2020.9254756"},{"volume-title":"Fundamentals of heat and mass transfer","year":"1996","author":"Incropera","key":"ref17"}],"event":{"name":"2022 IEEE 31st International Symposium on Industrial Electronics (ISIE)","start":{"date-parts":[[2022,6,1]]},"location":"Anchorage, AK, USA","end":{"date-parts":[[2022,6,3]]}},"container-title":["2022 IEEE 31st International Symposium on Industrial Electronics (ISIE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9831187\/9831454\/09831623.pdf?arnumber=9831623","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T06:44:26Z","timestamp":1706769866000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9831623\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6,1]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/isie51582.2022.9831623","relation":{},"subject":[],"published":{"date-parts":[[2022,6,1]]}}}