{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T11:33:16Z","timestamp":1725622396532},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,9]]},"DOI":"10.1109\/islped.2013.6629315","type":"proceedings-article","created":{"date-parts":[[2013,12,17]],"date-time":"2013-12-17T20:47:27Z","timestamp":1387313247000},"page":"311-316","source":"Crossref","is-referenced-by-count":8,"title":["Platform-dependent, leakage-aware control of the driving current of embedded thermoelectric coolers"],"prefix":"10.1109","author":[{"given":"Mohammad Javad","family":"Dousti","sequence":"first","affiliation":[]},{"given":"Massoud","family":"Pedram","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"17","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"key":"15","article-title":"Template based high packing density assembly for microchip solid state cooling application","author":"wang","year":"2006","journal-title":"3rd Conference on Foundations of Nanoscience Selfassembled Architectures and Devices (FNANO)"},{"key":"16","first-page":"1","article-title":"Onchip peltier cooling using current pulse","author":"gupta","year":"2010","journal-title":"13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1016\/j.enconman.2004.07.004"},{"key":"14","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature-aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proceedings of the 30th International Symposium on Computer Architecture"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-009-0694-6"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2011.42"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2008.417"},{"year":"2013","author":"bar-cohen","key":"2"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-0040-1_12"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837419"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1145\/2000064.2000104"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2004.1319241"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1201\/9781420038903"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879795"},{"key":"9","first-page":"117","article-title":"Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers","author":"long","year":"2010","journal-title":"Proceedings of the Design Automation and Test in Europe"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165033"}],"event":{"name":"2013 IEEE International Symposium on Low Power Electronics and Design (ISLPED)","start":{"date-parts":[[2013,9,4]]},"location":"Beijing, China","end":{"date-parts":[[2013,9,6]]}},"container-title":["International Symposium on Low Power Electronics and Design (ISLPED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6613639\/6629247\/06629315.pdf?arnumber=6629315","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,22]],"date-time":"2017-06-22T04:25:25Z","timestamp":1498105525000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6629315\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,9]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/islped.2013.6629315","relation":{},"subject":[],"published":{"date-parts":[[2013,9]]}}}