{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T03:03:59Z","timestamp":1725591839894},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,7,1]],"date-time":"2019-07-01T00:00:00Z","timestamp":1561939200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,7]]},"DOI":"10.1109\/islped.2019.8824866","type":"proceedings-article","created":{"date-parts":[[2019,9,5]],"date-time":"2019-09-05T23:11:46Z","timestamp":1567725106000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["A Low-Energy Inductive Transceiver using Spike-Latency Encoding for Wireless 3D Integration"],"prefix":"10.1109","author":[{"given":"Benjamin J.","family":"Fletcher","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shidhartha","family":"Das","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Terrence","family":"Mak","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2018.04.001"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8714863"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2004.1332634"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2881075"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373442"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/INEC.2016.7589315"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8342200"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2008.4523175"},{"key":"ref2","article-title":"3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10um pitch through-Si vias","author":"swinnen","year":"2006","journal-title":"Int Electron Devices Meeting"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.845560"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICSICT.2014.7021442"}],"event":{"name":"2019 IEEE\/ACM International Symposium on Low Power Electronics and Design (ISLPED)","start":{"date-parts":[[2019,7,29]]},"location":"Lausanne, Switzerland","end":{"date-parts":[[2019,7,31]]}},"container-title":["2019 IEEE\/ACM International Symposium on Low Power Electronics and Design (ISLPED)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8819888\/8824790\/08824866.pdf?arnumber=8824866","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T03:07:19Z","timestamp":1657854439000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8824866\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,7]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/islped.2019.8824866","relation":{},"subject":[],"published":{"date-parts":[[2019,7]]}}}