{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T08:07:46Z","timestamp":1730275666405,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,6]],"date-time":"2021-10-06T00:00:00Z","timestamp":1633478400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,6]],"date-time":"2021-10-06T00:00:00Z","timestamp":1633478400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,6]],"date-time":"2021-10-06T00:00:00Z","timestamp":1633478400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,6]]},"DOI":"10.1109\/isocc53507.2021.9613892","type":"proceedings-article","created":{"date-parts":[[2021,11,25]],"date-time":"2021-11-25T15:31:55Z","timestamp":1637854315000},"page":"427-428","source":"Crossref","is-referenced-by-count":0,"title":["Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory"],"prefix":"10.1109","author":[{"given":"Younwoo","family":"Yoo","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hayoung","family":"Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seung Ho","family":"Shin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sungho","family":"Kang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2062830"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"498","DOI":"10.1109\/MDT.2005.136","article-title":"Demystifying 3D ICs: The pros and cons of going vertical","volume":"22","author":"steer","year":"2005","journal-title":"IEEE Design Test Comput"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2523499"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2003.821925"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2020.2996747"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2353799"}],"event":{"name":"2021 18th International SoC Design Conference (ISOCC)","start":{"date-parts":[[2021,10,6]]},"location":"Jeju Island, Korea, Republic of","end":{"date-parts":[[2021,10,9]]}},"container-title":["2021 18th International SoC Design Conference (ISOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9613844\/9613845\/09613892.pdf?arnumber=9613892","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T12:52:34Z","timestamp":1652187154000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9613892\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,6]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/isocc53507.2021.9613892","relation":{},"subject":[],"published":{"date-parts":[[2021,10,6]]}}}