{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,6]],"date-time":"2025-12-06T04:45:56Z","timestamp":1764996356019},"reference-count":3,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,6]],"date-time":"2021-10-06T00:00:00Z","timestamp":1633478400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,10,6]],"date-time":"2021-10-06T00:00:00Z","timestamp":1633478400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,6]],"date-time":"2021-10-06T00:00:00Z","timestamp":1633478400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,6]]},"DOI":"10.1109\/isocc53507.2021.9614014","type":"proceedings-article","created":{"date-parts":[[2021,11,25]],"date-time":"2021-11-25T15:31:55Z","timestamp":1637854315000},"page":"347-348","source":"Crossref","is-referenced-by-count":2,"title":["Low Power High Performance Match Line Design of Content Addressable Memory"],"prefix":"10.1109","author":[{"given":"Hyunju","family":"Kim","sequence":"first","affiliation":[]},{"given":"Hyungtak","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Youngmin","family":"Kim","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref3","article-title":"Design and Implementation of a Low Power Ternary Content Addressable Memory (TCAM)","author":"karthik","year":"2020","journal-title":"ISOCC"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2518219"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.864128"}],"event":{"name":"2021 18th International SoC Design Conference (ISOCC)","start":{"date-parts":[[2021,10,6]]},"location":"Jeju Island, Korea, Republic of","end":{"date-parts":[[2021,10,9]]}},"container-title":["2021 18th International SoC Design Conference (ISOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9613844\/9613845\/09614014.pdf?arnumber=9614014","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T12:52:35Z","timestamp":1652187155000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9614014\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,6]]},"references-count":3,"URL":"https:\/\/doi.org\/10.1109\/isocc53507.2021.9614014","relation":{},"subject":[],"published":{"date-parts":[[2021,10,6]]}}}