{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,1,11]],"date-time":"2025-01-11T05:33:59Z","timestamp":1736573639524,"version":"3.32.0"},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,8,19]],"date-time":"2024-08-19T00:00:00Z","timestamp":1724025600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,8,19]],"date-time":"2024-08-19T00:00:00Z","timestamp":1724025600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,8,19]]},"DOI":"10.1109\/isocc62682.2024.10762423","type":"proceedings-article","created":{"date-parts":[[2024,11,29]],"date-time":"2024-11-29T18:49:10Z","timestamp":1732906150000},"page":"131-132","source":"Crossref","is-referenced-by-count":0,"title":["CARDS: A Novel Detailed Macro Placement Framework for Minimizing Wirelength"],"prefix":"10.1109","author":[{"given":"Yen-Lin","family":"Chua","sequence":"first","affiliation":[{"name":"National Central University,Department of Electrical Engineering,Taoyuan,Taiwan,320"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Meng-Shan","family":"Wu","sequence":"additional","affiliation":[{"name":"National Central University,Department of Electrical Engineering,Taoyuan,Taiwan,320"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Guang","family":"Chen","sequence":"additional","affiliation":[{"name":"National Central University,Department of Electrical Engineering,Taoyuan,Taiwan,320"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","first-page":"447","article-title":"MP-trees: A Packing-Based Macro Placement Algorithm for Mixed-Size Designs","volume-title":"ACM\/IEEE Design Automation Conference","author":"Chen"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/3287624.3287677"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/iccad.2017.8203819"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2008.923063"},{"key":"ref5","article-title":"ICCAD CAD Contest, 2022 Problem D"}],"event":{"name":"2024 21st International SoC Design Conference (ISOCC)","start":{"date-parts":[[2024,8,19]]},"location":"Sapporo, Japan","end":{"date-parts":[[2024,8,22]]}},"container-title":["2024 21st International SoC Design Conference (ISOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10761119\/10761994\/10762423.pdf?arnumber=10762423","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,10]],"date-time":"2025-01-10T19:50:36Z","timestamp":1736538636000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10762423\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8,19]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/isocc62682.2024.10762423","relation":{},"subject":[],"published":{"date-parts":[[2024,8,19]]}}}