{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T03:20:36Z","timestamp":1725420036199},"reference-count":13,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/isqed.2003.1194731","type":"proceedings-article","created":{"date-parts":[[2004,3,22]],"date-time":"2004-03-22T09:34:28Z","timestamp":1079948068000},"page":"195-200","source":"Crossref","is-referenced-by-count":9,"title":["A CAD-oriented modeling approach of frequency-dependent behavior of substrate noise coupling for mixed-signal IC design"],"prefix":"10.1109","author":[{"family":"Hai Lan","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Zhiping Yu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R.W.","family":"Dutton","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1971.1127658"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/22.868993"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/6040.784477"},{"key":"ref13","first-page":"16.6","article-title":"Methodology and experimental verification for substrate noise reduction in CMOS mixed-signal ICs with synchrounous digital circuits","author":"badaroglu","year":"2002","journal-title":"Proc Int Solid-State Conf"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/4.848209"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/43.743727"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/43.712097"},{"key":"ref5","doi-asserted-by":"crossref","DOI":"10.1109\/DAC.2002.1012727","article-title":"Combined BEM\/FEM substrate resistance modeling","author":"schrik","year":"2002","journal-title":"Proc Design Automation Conf"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2002.1012887"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/4.845193"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/4.661197"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/4.494196"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2001.979559"}],"event":{"name":"ISQED 2003: 4th International Symposium on Quality Electronic Design","acronym":"ISQED-03","location":"San Jose, CA, USA"},"container-title":["Fourth International Symposium on Quality Electronic Design, 2003. Proceedings."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8500\/26872\/01194731.pdf?arnumber=1194731","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,16]],"date-time":"2017-06-16T00:25:41Z","timestamp":1497572741000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1194731\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/isqed.2003.1194731","relation":{},"subject":[]}}