{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T21:16:17Z","timestamp":1725570977737},"reference-count":3,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/isqed.2004.1283670","type":"proceedings-article","created":{"date-parts":[[2004,5,6]],"date-time":"2004-05-06T16:18:03Z","timestamp":1083860283000},"page":"179-183","source":"Crossref","is-referenced-by-count":0,"title":["Design tools for packaging"],"prefix":"10.1109","author":[{"given":"L.","family":"Immaneni","sequence":"first","affiliation":[]},{"given":"A.","family":"Kapur","sequence":"additional","affiliation":[]},{"given":"B.","family":"Neal","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"IC-pkg Co Design Environment User's Guide","year":"0","key":"3"},{"journal-title":"PLA User's Guide","year":"0","key":"2"},{"key":"1","article-title":"Design tools for the interconnect continuum: A packaging perspective","author":"choksi","year":"1998","journal-title":"IATTJ"}],"event":{"name":"5th International Symposium on Quality Electronic Design","acronym":"ISQED-04","location":"San Jose, CA, USA"},"container-title":["SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9029\/28654\/01283670.pdf?arnumber=1283670","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,13]],"date-time":"2017-03-13T18:02:51Z","timestamp":1489428171000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1283670\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":3,"URL":"https:\/\/doi.org\/10.1109\/isqed.2004.1283670","relation":{},"subject":[]}}