{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T22:32:43Z","timestamp":1729636363646,"version":"3.28.0"},"reference-count":15,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/isqed.2004.1283671","type":"proceedings-article","created":{"date-parts":[[2004,5,6]],"date-time":"2004-05-06T20:18:03Z","timestamp":1083874683000},"page":"184-189","source":"Crossref","is-referenced-by-count":0,"title":["Robustness enhancement through chip-package co-design for high-speed electronics"],"prefix":"10.1109","author":[{"family":"Melgen Shen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Li-Rong Zheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"H.","family":"Tenhunen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"15","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9781139166980"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/5.920582"},{"key":"14","doi-asserted-by":"crossref","first-page":"750","DOI":"10.1109\/PROC.1982.12381","article-title":"Time-domain skin-effect model for transient analysis of lossy transmission line","volume":"70","author":"yen","year":"1982","journal-title":"Proc IEEE"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/4.148326"},{"journal-title":"International Technology Roadmap for Semiconductors 2003 Edition","year":"0","key":"12"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/4.918912"},{"journal-title":"Digital Signal Integrity Modeling and Simulation With Interconnects and Packages","year":"2001","author":"young","key":"2"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2000.853160"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/33.52863"},{"journal-title":"Multilevel Singling","year":"2000","author":"johnson","key":"7"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/4.760366"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2002.808282"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/6040.784478"},{"journal-title":"Design Analysis and Integration of Mixed-signal Systems for Signal and Power Integrity","year":"0","author":"zheng","key":"9"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/15.809819"}],"event":{"name":"5th International Symposium on Quality Electronic Design","acronym":"ISQED-04","location":"San Jose, CA, USA"},"container-title":["SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9029\/28654\/01283671.pdf?arnumber=1283671","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,16]],"date-time":"2017-06-16T06:52:36Z","timestamp":1497595956000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1283671\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/isqed.2004.1283671","relation":{},"subject":[]}}