{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T00:15:17Z","timestamp":1729642517957,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE Comput. Soc","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/isqed.2004.1283677","type":"proceedings-article","created":{"date-parts":[[2004,5,6]],"date-time":"2004-05-06T16:18:03Z","timestamp":1083860283000},"page":"225-230","source":"Crossref","is-referenced-by-count":0,"title":["Physically-based simulation of electromigration induced failures in copper dual-damascene interconnect"],"prefix":"10.1109","author":[{"given":"V.","family":"Sukharev","sequence":"first","affiliation":[]}],"member":"263","reference":[{"key":"17","first-page":"305","author":"zschech","year":"2002","journal-title":"Proc Advancer Metallization Conference (AMC 2002)"},{"key":"15","doi-asserted-by":"crossref","first-page":"1625","DOI":"10.1016\/S0026-2714(01)00151-2","volume":"41","author":"dalleau","year":"2001","journal-title":"Microelectronics Reliab"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1063\/1.1659998"},{"journal-title":"Mathematical analysis and numerical simulation of electromigration","year":"2002","author":"wilkening","key":"13"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"11","doi-asserted-by":"crossref","first-page":"611","DOI":"10.1046\/j.1460-2695.1998.00057.x","volume":"21","author":"bower","year":"1998","journal-title":"Fatigue and Fracture of Engineering Materials and Structures"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1006\/jcph.2000.6677"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/7298.946458"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1088\/0034-4885\/52\/3\/002"},{"key":"1","volume":"149","author":"hu","year":"2002","journal-title":"J Electrohem Soc"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.80.1674"},{"journal-title":"Proc of the 5th Int Workshop on Stress Induced Phenomena in Metallization","year":"1999","author":"rzepka","key":"7"},{"journal-title":"FEMLAB Code","year":"0","key":"6"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1063\/1.369714"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1080\/10408439708241261"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1016\/S1359-6454(96)00121-8"},{"key":"8","doi-asserted-by":"crossref","first-page":"1917","DOI":"10.1007\/BF02670663","volume":"26 a","author":"mullins","year":"1995","journal-title":"Metallurgical and Materials Transactions A"}],"event":{"name":"5th International Symposium on Quality Electronic Design","acronym":"ISQED-04","location":"San Jose, CA, USA"},"container-title":["SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/9029\/28654\/01283677.pdf?arnumber=1283677","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,16]],"date-time":"2017-06-16T02:52:36Z","timestamp":1497581556000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1283677\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/isqed.2004.1283677","relation":{},"subject":[]}}