{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T11:56:39Z","timestamp":1763726199642,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,3]]},"DOI":"10.1109\/isqed.2008.4479795","type":"proceedings-article","created":{"date-parts":[[2008,4,2]],"date-time":"2008-04-02T14:55:10Z","timestamp":1207148110000},"page":"553-556","source":"Crossref","is-referenced-by-count":30,"title":["Analytical Model for the Propagation Delay of Through Silicon Vias"],"prefix":"10.1109","author":[{"given":"DiaaEldin","family":"Khalil","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yehea","family":"Ismail","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Muhammad","family":"Khellah","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tanay","family":"Karnik","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vivek","family":"De","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"year":"0","key":"17"},{"journal-title":"reference manual","year":"1999","author":"star-hspice","key":"15"},{"key":"16","doi-asserted-by":"crossref","first-page":"1443","DOI":"10.1109\/22.297805","article-title":"capacitance computations in a multilayered dielectric medium using closed-form spatial green's functions","volume":"42","author":"oh","year":"1994","journal-title":"IEEE Transactions on Microwave Theory and Techniques"},{"journal-title":"Dimensional Analysis and Theory of Models","year":"1951","author":"langhaar","key":"13"},{"journal-title":"Applied Dimensional Analysis and Modeling","year":"1997","author":"szirtes","key":"14"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1983.1051966"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/92.831439"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/92.902261"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/5.929647"},{"journal-title":"Edition","year":"2005","key":"1"},{"key":"10","first-page":"151","article-title":"high frequency electrical circuit model of chip-to-chip vertical via interconnection for 3-d chip stacking package","author":"ryu","year":"2005","journal-title":"Proc IEEE Topical Meeting on Electrical Performance of Electronic Packaging"},{"key":"7","first-page":"18","article-title":"electrical through-wafer interconnects with sub-pico farad parasitic capacitance","author":"cheng","year":"2001","journal-title":"Proc Conf Microelectromech Syst"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2004.1347939"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2002.1014915"},{"key":"4","first-page":"414","article-title":"power trends and performance characterization of 3-dimensional integration","volume":"4","author":"zhang","year":"2001","journal-title":"Proc of IEEE International Symposium on Circuits and Systems"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.852782"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/WMED.2004.1297363"}],"event":{"name":"2008 9th International Symposium of Quality of Electronic Design (ISQED)","start":{"date-parts":[[2008,3,17]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2008,3,19]]}},"container-title":["9th International Symposium on Quality Electronic Design (isqed 2008)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4479672\/4479673\/04479795.pdf?arnumber=4479795","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,18]],"date-time":"2017-06-18T02:15:51Z","timestamp":1497752151000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4479795\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,3]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/isqed.2008.4479795","relation":{},"subject":[],"published":{"date-parts":[[2008,3]]}}}