{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T19:23:37Z","timestamp":1725564217700},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,3]]},"DOI":"10.1109\/isqed.2008.4479821","type":"proceedings-article","created":{"date-parts":[[2008,4,2]],"date-time":"2008-04-02T14:55:10Z","timestamp":1207148110000},"page":"691-696","source":"Crossref","is-referenced-by-count":3,"title":["Investigating the Design, Performance, and Reliability of Multi-Walled Carbon Nanotube Interconnect"],"prefix":"10.1109","author":[{"given":"Arthur","family":"Nieuwoudt","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yehia","family":"Massoud","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2001.929760"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.890364"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1088\/0957-4484\/16\/9\/074"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1063\/1.1396632"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1021\/jp021271u"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1016\/j.cplett.2004.09.115"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.853702"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1007\/s003390201279"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1038\/34139"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1145\/1167943.1167944"},{"journal-title":"International Technology Roadmap for Semiconductors","year":"2005","key":"1"},{"key":"10","doi-asserted-by":"crossref","first-page":"568","DOI":"10.1145\/1278480.1278624","article-title":"performance modeling and optimization for single- and multi-wall carbon nanotube interconnects","author":"naeemi","year":"2007","journal-title":"2007 44th ACM\/IEEE Design Automation Conference DAC"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.882035"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2006.873765"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1093\/ietele\/e89-c.11.1499"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.95.086601"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/NANO.2007.4601276"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2006.883480"}],"event":{"name":"2008 9th International Symposium of Quality of Electronic Design (ISQED)","start":{"date-parts":[[2008,3,17]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2008,3,19]]}},"container-title":["9th International Symposium on Quality Electronic Design (isqed 2008)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4479672\/4479673\/04479821.pdf?arnumber=4479821","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,18]],"date-time":"2017-06-18T02:15:47Z","timestamp":1497752147000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4479821\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,3]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/isqed.2008.4479821","relation":{},"subject":[],"published":{"date-parts":[[2008,3]]}}}