{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T05:49:37Z","timestamp":1729662577789,"version":"3.28.0"},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,3]]},"DOI":"10.1109\/isqed.2008.4479826","type":"proceedings-article","created":{"date-parts":[[2008,4,2]],"date-time":"2008-04-02T18:55:10Z","timestamp":1207162510000},"page":"718-723","source":"Crossref","is-referenced-by-count":4,"title":["Characterizing Intra-Die Spatial Correlation Using Spectral Density Method"],"prefix":"10.1109","author":[{"given":"Qiang","family":"Fu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wai-Shing","family":"Luk","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Tao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Changhao","family":"Yan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Statistics for Spatial Data","year":"1991","author":"cressie","key":"19"},{"journal-title":"Signals and Systems","year":"1996","author":"oppenheim","key":"17"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1137\/0806023"},{"key":"15","article-title":"wavelet representations for spatial processes","author":"whitcher","year":"2001","journal-title":"SIAM Conf on Mathematical and Computational Issues in the Geosciences"},{"journal-title":"Probability and Statistical Inference","year":"2001","author":"hogg","key":"16"},{"key":"13","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4615-7892-5","author":"mate?rn","year":"1986","journal-title":"Spatial Variation"},{"key":"14","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4612-1494-6","author":"stein","year":"1999","journal-title":"Interpolation of Spatial Data Some Theory for Kriging"},{"key":"11","first-page":"817","author":"liu","year":"2007","journal-title":"A general framework for spatial correlation modeling in VLSI design"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-61943-4"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.850834"},{"key":"2","doi-asserted-by":"crossref","DOI":"10.1145\/1120725.1120749","article-title":"embedded tutorial i: design for manufacturability","volume":"1","author":"pitchumani","year":"2005","journal-title":"ASP-DAC"},{"key":"1","first-page":"451","article-title":"design for variability in","author":"nassif","year":"2000","journal-title":"ISQED"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.884403"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/43.998626"},{"key":"6","first-page":"93","author":"heloue","year":"2007","journal-title":"Modeling and estimation of full-chip leakage current considering within-die correlation"},{"key":"5","first-page":"791","author":"bhardwaj","year":"2006","journal-title":"Modeling of intra-die process variations for accurate analysis and optimization of nano-scale circuits"},{"key":"4","article-title":"statistical timing analysis with path reconvergence and spatial correlations","author":"zhang","year":"2006","journal-title":"DATE"},{"key":"9","first-page":"131","article-title":"a unified statistical model for inter-die and intra-die process variation","author":"doh","year":"2005","journal-title":"2005 International Conference On Simulation of Semiconductor Processes and Devices"},{"key":"8","first-page":"516","author":"friedberg","year":"2005","journal-title":"ISQED"}],"event":{"name":"2008 9th International Symposium of Quality of Electronic Design (ISQED)","start":{"date-parts":[[2008,3,17]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2008,3,19]]}},"container-title":["9th International Symposium on Quality Electronic Design (isqed 2008)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4479672\/4479673\/04479826.pdf?arnumber=4479826","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,18]],"date-time":"2017-06-18T06:15:50Z","timestamp":1497766550000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4479826\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,3]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/isqed.2008.4479826","relation":{},"subject":[],"published":{"date-parts":[[2008,3]]}}}