{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T08:15:26Z","timestamp":1730276126702,"version":"3.28.0"},"reference-count":24,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,3]]},"DOI":"10.1109\/isqed.2008.4479851","type":"proceedings-article","created":{"date-parts":[[2008,4,2]],"date-time":"2008-04-02T18:55:10Z","timestamp":1207162510000},"page":"861-866","source":"Crossref","is-referenced-by-count":2,"title":["Towards Uniform Temperature Distribution in SOI Circuits Using Carbon Nanotube Based Thermal Interconnect"],"prefix":"10.1109","author":[{"given":"Yu","family":"Zhou","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Somnath","family":"Paul","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Swarup","family":"Bhunia","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2006.875876"},{"year":"0","key":"22"},{"year":"0","key":"17"},{"year":"0","key":"23"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2007.892079"},{"year":"0","key":"24"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.89.075505"},{"article-title":"carbon nanotube thermal interface structures","year":"0","author":"montgomery","key":"16"},{"year":"0","key":"13"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1038\/416495a"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609320"},{"year":"0","key":"12"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.59.R2514"},{"key":"3","first-page":"93","article-title":"localized and cmos compatible growth of carbon nanotubes on a 3x3 (m2 microheater spot","author":"jungen","year":"2005","journal-title":"Transducers"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.87.215502"},{"key":"2","article-title":"temperature aware micro-architecture","author":"skadron","year":"2003","journal-title":"ISCA"},{"key":"1","article-title":"managing the impact of increasing microprocessor power consumption","author":"gunther","year":"2001","journal-title":"Intel Tech"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560098"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.1998.689614"},{"key":"6","first-page":"640","article-title":"characterize the thermal properties of the vertical aligned carbon nanotubes array used for ic cooling with photothermal method","volume":"2","author":"zhang","year":"2006","journal-title":"IEEE-NANO"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2006.320104"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.885064"},{"year":"0","key":"9"},{"year":"0","key":"8"}],"event":{"name":"2008 9th International Symposium of Quality of Electronic Design (ISQED)","start":{"date-parts":[[2008,3,17]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2008,3,19]]}},"container-title":["9th International Symposium on Quality Electronic Design (isqed 2008)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4479672\/4479673\/04479851.pdf?arnumber=4479851","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,16]],"date-time":"2017-03-16T18:58:18Z","timestamp":1489690698000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4479851\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,3]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/isqed.2008.4479851","relation":{},"subject":[],"published":{"date-parts":[[2008,3]]}}}