{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T12:06:11Z","timestamp":1759147571126},"reference-count":16,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,3]]},"DOI":"10.1109\/isqed.2009.4810285","type":"proceedings-article","created":{"date-parts":[[2009,4,3]],"date-time":"2009-04-03T18:50:11Z","timestamp":1238784611000},"page":"147-155","source":"Crossref","is-referenced-by-count":27,"title":["3D-GCP: An analytical model for the impact of process variations on the critical path delay distribution of 3D ICs"],"prefix":"10.1109","author":[{"given":"Siddharth","family":"Garg","sequence":"first","affiliation":[]},{"given":"Diana","family":"Marculescu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"15","DOI":"10.1109\/MICRO.2007.43"},{"doi-asserted-by":"publisher","key":"16","DOI":"10.1109\/TED.2006.884077"},{"doi-asserted-by":"publisher","key":"13","DOI":"10.1109\/ICCAD.2006.320152"},{"doi-asserted-by":"publisher","key":"14","DOI":"10.1145\/1065579.1065588"},{"doi-asserted-by":"publisher","key":"11","DOI":"10.1109\/5.920580"},{"doi-asserted-by":"publisher","key":"12","DOI":"10.1145\/1250662.1250680"},{"key":"3","doi-asserted-by":"crossref","DOI":"10.1109\/4.982424","article-title":"impact of die-to- die and within-die parameter uctuations on the maximum clock frequency distribution for gigascale integration","author":"bowman","year":"2002","journal-title":"IEEE Journal of Solid-State Circuits"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1109\/5.929647"},{"key":"1","doi-asserted-by":"crossref","DOI":"10.1214\/lnms\/1215467924","author":"adler","year":"1990","journal-title":"An Introduction to Continuity Extrema and Related Topics for General Gaussian Processes"},{"key":"10","article-title":"reclaiming perfor- mance and energy eciency from variability","author":"herbert","year":"2006","journal-title":"Proceedings of IBM Pac2"},{"doi-asserted-by":"publisher","key":"7","DOI":"10.1109\/IWSTM.2000.869312"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1145\/369691.369763"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1109\/ICCAD.2004.1382591"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1017\/CBO9780511804441"},{"key":"9","article-title":"techniques for pro- ducing 3d ics with high-density interconnect","author":"gupta","year":"2004","journal-title":"Proceedings of the 21st International VLSI Multilevel Interconnection Confer- ence"},{"key":"8","article-title":"strategies for improving the parametric yield and profits of 3d ics","author":"ferri","year":"2007","journal-title":"Proceedings of ICCAD"}],"event":{"name":"2009 10th International Symposium on Quality of Electronic Design (ISQED)","start":{"date-parts":[[2009,3,16]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2009,3,18]]}},"container-title":["2009 10th International Symposium on Quality of Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4804412\/4810250\/04810285.pdf?arnumber=4810285","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,12]],"date-time":"2024-03-12T10:41:48Z","timestamp":1710240108000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4810285\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,3]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/isqed.2009.4810285","relation":{},"subject":[],"published":{"date-parts":[[2009,3]]}}}