{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T12:06:24Z","timestamp":1759147584340},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,3]]},"DOI":"10.1109\/isqed.2009.4810319","type":"proceedings-article","created":{"date-parts":[[2009,4,3]],"date-time":"2009-04-03T14:50:11Z","timestamp":1238770211000},"page":"350-355","source":"Crossref","is-referenced-by-count":17,"title":["Performance evaluation of wireless networks on chip architectures"],"prefix":"10.1109","author":[{"given":"Amlan","family":"Ganguly","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kevin","family":"Chang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Partha Pratim","family":"Pande","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Benjamin","family":"Belzer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alireza","family":"Nojeh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"Circuits Multi-Projects","year":"0","key":"19"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2008.916912"},{"year":"0","key":"18"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2005.1441406"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1364\/OE.15.017106"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2007.915017"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1021\/nl049607u"},{"key":"11","first-page":"72","article-title":"a 0.18 m cmos impulse radio based uwb transmitter for global wireless interconnections of 3d stacked-chip system","author":"fukuda","year":"2006","journal-title":"Proc Int'l Conf Solid State Devices and Materials"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2006.886516"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.78"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.893649"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2005.134"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2006.877430"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/4.997846"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1002\/adma.200601187"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.900236"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2008.4658639"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.73.195416"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.86"}],"event":{"name":"2009 10th International Symposium on Quality of Electronic Design (ISQED)","start":{"date-parts":[[2009,3,16]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2009,3,18]]}},"container-title":["2009 10th International Symposium on Quality of Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4804412\/4810250\/04810319.pdf?arnumber=4810319","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T14:48:18Z","timestamp":1489762098000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4810319\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,3]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/isqed.2009.4810319","relation":{},"subject":[],"published":{"date-parts":[[2009,3]]}}}