{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,4]],"date-time":"2025-11-04T10:17:55Z","timestamp":1762251475216},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,3]]},"DOI":"10.1109\/isqed.2009.4810355","type":"proceedings-article","created":{"date-parts":[[2009,4,3]],"date-time":"2009-04-03T18:50:11Z","timestamp":1238784611000},"page":"559-564","source":"Crossref","is-referenced-by-count":2,"title":["Retrospective on electronics technology and prospective methods for co-design of IC packaging and manufacturing improvements"],"prefix":"10.1109","author":[{"given":"Joseph","family":"Fjelstad","sequence":"first","affiliation":[]}],"member":"263","reference":[{"key":"3","first-page":"12","article-title":"3-d partitioning of printed circuit design - 'elevated highway bypass' packaging design","author":"fjelstad","year":"2005","journal-title":"Advanced Packaging"},{"year":"0","key":"2"},{"year":"0","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1108\/03056129910268927"},{"key":"6","article-title":"high-frequency vibration tests of sn-pb &7 lead-free solder joints","author":"de maio","year":"2008","journal-title":"Proceedings IEMRC\/TWI Technical Seminar Developments in Interconnection Assembly and Packaging December"},{"year":"0","key":"5"},{"key":"4","article-title":"designing scalable 10g backplane interconnect systems utilizing advanced verification methodologies","author":"grundy","year":"2006","journal-title":"Proceedings DesignCon"},{"year":"0","key":"8"}],"event":{"name":"2009 10th International Symposium on Quality Electronic Design (ISQED 2009)","start":{"date-parts":[[2009,3,16]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2009,3,18]]}},"container-title":["2009 10th International Symposium on Quality Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4804412\/4810250\/04810355.pdf?arnumber=4810355","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,4,23]],"date-time":"2021-04-23T21:20:35Z","timestamp":1619212835000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/4810355\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,3]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/isqed.2009.4810355","relation":{},"subject":[],"published":{"date-parts":[[2009,3]]}}}