{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T11:47:58Z","timestamp":1759146478657,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,3]]},"DOI":"10.1109\/isqed.2009.4810357","type":"proceedings-article","created":{"date-parts":[[2009,4,3]],"date-time":"2009-04-03T14:50:11Z","timestamp":1238770211000},"page":"569-575","source":"Crossref","is-referenced-by-count":13,"title":["Die\/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology"],"prefix":"10.1109","author":[{"given":"Syed M.","family":"Alam","sequence":"first","affiliation":[]},{"given":"Robert E.","family":"Jones","sequence":"additional","affiliation":[]},{"given":"Scott","family":"Pozder","sequence":"additional","affiliation":[]},{"given":"Ankur","family":"Jain","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"year":"0","key":"17"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2008.4544389"},{"key":"16","first-page":"681","article-title":"thermal analysis of heterogeneous 3-d ics with various integration scenarios","author":"chiang","year":"2001","journal-title":"IEDM Tech Digest"},{"key":"13","article-title":"testing 3d stacked devices","volume":"23","author":"crouch","year":"2007","journal-title":"Future Fab Intl"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2006.58"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/1148015.1148016"},{"key":"12","article-title":"maximizing the functional yield of wafer-to-wafer 3d integration","author":"reda","year":"2008","journal-title":"IEEE Transactions on very large scale integration Systems"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2004.1347939"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2006.873424"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609348"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/96.544361"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.1993.346858"},{"key":"6","article-title":"mask prices flatten but tool costs soar","author":"lapedus","year":"0","journal-title":"EE Times"},{"key":"5","first-page":"580","article-title":"inter-strata connection elements and signal transmission in three-dimensional (3d) integrated circuits","author":"alam","year":"2007","journal-title":"Proc IEEE International Symposium on Quality Electronic Design"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.873612"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.134"}],"event":{"name":"2009 10th International Symposium on Quality of Electronic Design (ISQED)","start":{"date-parts":[[2009,3,16]]},"location":"San Jose, CA, USA","end":{"date-parts":[[2009,3,18]]}},"container-title":["2009 10th International Symposium on Quality of Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4804412\/4810250\/04810357.pdf?arnumber=4810357","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T15:43:18Z","timestamp":1489765398000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4810357\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,3]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/isqed.2009.4810357","relation":{},"subject":[],"published":{"date-parts":[[2009,3]]}}}