{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T07:40:23Z","timestamp":1729669223229,"version":"3.28.0"},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,3]]},"DOI":"10.1109\/isqed.2011.5770770","type":"proceedings-article","created":{"date-parts":[[2011,5,24]],"date-time":"2011-05-24T19:17:26Z","timestamp":1306264646000},"page":"1-8","source":"Crossref","is-referenced-by-count":3,"title":["Switching constraint-driven thermal and reliability analysis of Nanometer designs"],"prefix":"10.1109","author":[{"given":"Srini","family":"Krishnamoorthy","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vishak","family":"Venkatraman","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuri","family":"Apanovich","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thomas","family":"Burd","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anand","family":"Daga","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/16.163460"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2000.838893"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"572","DOI":"10.1109\/DAC.1998.724536","article-title":"A practical approach to static signal electromigration analysis","author":"nagaraj","year":"1998","journal-title":"Proceedings 1998 Design and Automation Conference 35th DAC (Cat No 98CH36175) DAC"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/240518.240661"},{"key":"ref14","article-title":"Static Electromigration Analysis for Signal Interconnects","author":"oh","year":"2003","journal-title":"Proc Int Symposium on Quality Electronic Design"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2017428"},{"year":"0","key":"ref16"},{"year":"0","key":"ref17"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1997.649463"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2006.346879"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.1995.520712"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.847944"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/16.8800"},{"key":"ref7","article-title":"A Unified Gate Oxide Reliability Model","author":"hu","year":"1999","journal-title":"Proc Int Reliability Physics Symposium"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.1993.283282"},{"key":"ref1","first-page":"148","article-title":"Mass Transport of Aluminum by Momentum Exchange with Conduction Electrons","author":"black","year":"1967","journal-title":"Proc Int Reliability Physics Symposium"},{"key":"ref9","first-page":"9","article-title":"On the formation of surface states during stress aging of thermal Si-SiO2 Interfaces","volume":"120","author":"strain","year":"1973","journal-title":"J Electrochem Soc"}],"event":{"name":"2011 International Symposium on Quality Electronic Design (ISQED)","start":{"date-parts":[[2011,3,14]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2011,3,16]]}},"container-title":["2011 12th International Symposium on Quality Electronic Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5764309\/5770683\/05770770.pdf?arnumber=5770770","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T00:42:43Z","timestamp":1497919363000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5770770\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,3]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/isqed.2011.5770770","relation":{},"subject":[],"published":{"date-parts":[[2011,3]]}}}